Loading…
Investigation of the Reliability Behavior of Conductive-Bridging Memory Cells
Conductive-bridging memory can store information as different resistance states even when not powered. In order to check reliability challenges for nonvolatile-memory applications, the data retention has to be tested carefully. This letter describes a new test scheme using electrical bias for accele...
Saved in:
Published in: | IEEE electron device letters 2009-08, Vol.30 (8), p.876-878 |
---|---|
Main Authors: | , , , |
Format: | Article |
Language: | English |
Subjects: | |
Citations: | Items that this one cites Items that cite this one |
Online Access: | Get full text |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
cited_by | cdi_FETCH-LOGICAL-c383t-96c68d55d6b54fac434f7e9ef4c79135273de35b0f08832f5a853fe2477d6e803 |
---|---|
cites | cdi_FETCH-LOGICAL-c383t-96c68d55d6b54fac434f7e9ef4c79135273de35b0f08832f5a853fe2477d6e803 |
container_end_page | 878 |
container_issue | 8 |
container_start_page | 876 |
container_title | IEEE electron device letters |
container_volume | 30 |
creator | Symanczyk, R. Bruchhaus, R. Dittrich, R. Kund, M. |
description | Conductive-bridging memory can store information as different resistance states even when not powered. In order to check reliability challenges for nonvolatile-memory applications, the data retention has to be tested carefully. This letter describes a new test scheme using electrical bias for acceleration and enables the fast recording of such detailed information. Experimental data for memory devices based on Ag:GeS 2 as the active-matrix material are presented. Excellent stability and reproducibility of the resistance states for more than 300 cycles are demonstrated in the temperature range from 25degC to 85degC. Based on the calculated activation energy, ten years of data retention is extrapolated. |
doi_str_mv | 10.1109/LED.2009.2024623 |
format | article |
fullrecord | <record><control><sourceid>proquest_ieee_</sourceid><recordid>TN_cdi_ieee_primary_5161279</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><ieee_id>5161279</ieee_id><sourcerecordid>2543453241</sourcerecordid><originalsourceid>FETCH-LOGICAL-c383t-96c68d55d6b54fac434f7e9ef4c79135273de35b0f08832f5a853fe2477d6e803</originalsourceid><addsrcrecordid>eNp90ctLYzEUB-AgClN19gNuLgPq6jp5P5Zan1AZGGbWIc09qZHbGye5LfS_N6XFhQs3yeJ853CSH0I_CL4iBJtfs7vbK4qxqQflkrIDNCFC6BYLyQ7RBCtOWkaw_IaOS3nFmHCu-AQ9Pw1rKGNcuDGmoUmhGV-g-QN9dPPYx3HT3MCLW8eUt7VpGrqVH-Ma2pscu0UcFs0zLFPeNFPo-3KKjoLrC3zf3yfo3_3d3-ljO_v98DS9nrWeaTa2RnqpOyE6ORc8OM8ZDwoMBO6VIUxQxTpgYo4D1prRIJwWLADlSnUSNGYn6HI39y2n_6u6v13G4usGboC0KlYrgYnCZisvvpSsQqYEr_DnJ_iaVnmor7CG1D-VgpmK8A75nErJEOxbjkuXN5Zgu43B1hjsNga7j6G2nO_nuuJdH7IbfCwffZRoarhQ1Z3tXASAj7IgklBl2DuBK46k</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>912026539</pqid></control><display><type>article</type><title>Investigation of the Reliability Behavior of Conductive-Bridging Memory Cells</title><source>IEEE Xplore (Online service)</source><creator>Symanczyk, R. ; Bruchhaus, R. ; Dittrich, R. ; Kund, M.</creator><creatorcontrib>Symanczyk, R. ; Bruchhaus, R. ; Dittrich, R. ; Kund, M.</creatorcontrib><description>Conductive-bridging memory can store information as different resistance states even when not powered. In order to check reliability challenges for nonvolatile-memory applications, the data retention has to be tested carefully. This letter describes a new test scheme using electrical bias for acceleration and enables the fast recording of such detailed information. Experimental data for memory devices based on Ag:GeS 2 as the active-matrix material are presented. Excellent stability and reproducibility of the resistance states for more than 300 cycles are demonstrated in the temperature range from 25degC to 85degC. Based on the calculated activation energy, ten years of data retention is extrapolated.</description><identifier>ISSN: 0741-3106</identifier><identifier>EISSN: 1558-0563</identifier><identifier>DOI: 10.1109/LED.2009.2024623</identifier><identifier>CODEN: EDLEDZ</identifier><language>eng</language><publisher>New York, NY: IEEE</publisher><subject>Active matrix technology ; Applied sciences ; Bridges ; CBRAM ; chalcogenide ; Conducting materials ; Data storage ; Design. Technologies. Operation analysis. Testing ; Electric resistance ; Electrodes ; Electronics ; Exact sciences and technology ; Extrapolation ; Integrated circuits ; Integrated circuits by function (including memories and processors) ; Life estimation ; Magnetic and optical mass memories ; Mathematical analysis ; Memory devices ; Nonvolatile memory ; Recording ; reliability ; Reproducibility ; Resistivity ; retention ; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices ; Solids ; Stability ; Storage and reproduction of information ; Stores ; Testing</subject><ispartof>IEEE electron device letters, 2009-08, Vol.30 (8), p.876-878</ispartof><rights>2009 INIST-CNRS</rights><rights>Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) 2009</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c383t-96c68d55d6b54fac434f7e9ef4c79135273de35b0f08832f5a853fe2477d6e803</citedby><cites>FETCH-LOGICAL-c383t-96c68d55d6b54fac434f7e9ef4c79135273de35b0f08832f5a853fe2477d6e803</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/5161279$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>314,780,784,27924,27925,54796</link.rule.ids><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=21829457$$DView record in Pascal Francis$$Hfree_for_read</backlink></links><search><creatorcontrib>Symanczyk, R.</creatorcontrib><creatorcontrib>Bruchhaus, R.</creatorcontrib><creatorcontrib>Dittrich, R.</creatorcontrib><creatorcontrib>Kund, M.</creatorcontrib><title>Investigation of the Reliability Behavior of Conductive-Bridging Memory Cells</title><title>IEEE electron device letters</title><addtitle>LED</addtitle><description>Conductive-bridging memory can store information as different resistance states even when not powered. In order to check reliability challenges for nonvolatile-memory applications, the data retention has to be tested carefully. This letter describes a new test scheme using electrical bias for acceleration and enables the fast recording of such detailed information. Experimental data for memory devices based on Ag:GeS 2 as the active-matrix material are presented. Excellent stability and reproducibility of the resistance states for more than 300 cycles are demonstrated in the temperature range from 25degC to 85degC. Based on the calculated activation energy, ten years of data retention is extrapolated.</description><subject>Active matrix technology</subject><subject>Applied sciences</subject><subject>Bridges</subject><subject>CBRAM</subject><subject>chalcogenide</subject><subject>Conducting materials</subject><subject>Data storage</subject><subject>Design. Technologies. Operation analysis. Testing</subject><subject>Electric resistance</subject><subject>Electrodes</subject><subject>Electronics</subject><subject>Exact sciences and technology</subject><subject>Extrapolation</subject><subject>Integrated circuits</subject><subject>Integrated circuits by function (including memories and processors)</subject><subject>Life estimation</subject><subject>Magnetic and optical mass memories</subject><subject>Mathematical analysis</subject><subject>Memory devices</subject><subject>Nonvolatile memory</subject><subject>Recording</subject><subject>reliability</subject><subject>Reproducibility</subject><subject>Resistivity</subject><subject>retention</subject><subject>Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices</subject><subject>Solids</subject><subject>Stability</subject><subject>Storage and reproduction of information</subject><subject>Stores</subject><subject>Testing</subject><issn>0741-3106</issn><issn>1558-0563</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2009</creationdate><recordtype>article</recordtype><recordid>eNp90ctLYzEUB-AgClN19gNuLgPq6jp5P5Zan1AZGGbWIc09qZHbGye5LfS_N6XFhQs3yeJ853CSH0I_CL4iBJtfs7vbK4qxqQflkrIDNCFC6BYLyQ7RBCtOWkaw_IaOS3nFmHCu-AQ9Pw1rKGNcuDGmoUmhGV-g-QN9dPPYx3HT3MCLW8eUt7VpGrqVH-Ma2pscu0UcFs0zLFPeNFPo-3KKjoLrC3zf3yfo3_3d3-ljO_v98DS9nrWeaTa2RnqpOyE6ORc8OM8ZDwoMBO6VIUxQxTpgYo4D1prRIJwWLADlSnUSNGYn6HI39y2n_6u6v13G4usGboC0KlYrgYnCZisvvpSsQqYEr_DnJ_iaVnmor7CG1D-VgpmK8A75nErJEOxbjkuXN5Zgu43B1hjsNga7j6G2nO_nuuJdH7IbfCwffZRoarhQ1Z3tXASAj7IgklBl2DuBK46k</recordid><startdate>20090801</startdate><enddate>20090801</enddate><creator>Symanczyk, R.</creator><creator>Bruchhaus, R.</creator><creator>Dittrich, R.</creator><creator>Kund, M.</creator><general>IEEE</general><general>Institute of Electrical and Electronics Engineers</general><general>The Institute of Electrical and Electronics Engineers, Inc. (IEEE)</general><scope>97E</scope><scope>RIA</scope><scope>RIE</scope><scope>IQODW</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7SP</scope><scope>8FD</scope><scope>L7M</scope><scope>F28</scope><scope>FR3</scope></search><sort><creationdate>20090801</creationdate><title>Investigation of the Reliability Behavior of Conductive-Bridging Memory Cells</title><author>Symanczyk, R. ; Bruchhaus, R. ; Dittrich, R. ; Kund, M.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c383t-96c68d55d6b54fac434f7e9ef4c79135273de35b0f08832f5a853fe2477d6e803</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2009</creationdate><topic>Active matrix technology</topic><topic>Applied sciences</topic><topic>Bridges</topic><topic>CBRAM</topic><topic>chalcogenide</topic><topic>Conducting materials</topic><topic>Data storage</topic><topic>Design. Technologies. Operation analysis. Testing</topic><topic>Electric resistance</topic><topic>Electrodes</topic><topic>Electronics</topic><topic>Exact sciences and technology</topic><topic>Extrapolation</topic><topic>Integrated circuits</topic><topic>Integrated circuits by function (including memories and processors)</topic><topic>Life estimation</topic><topic>Magnetic and optical mass memories</topic><topic>Mathematical analysis</topic><topic>Memory devices</topic><topic>Nonvolatile memory</topic><topic>Recording</topic><topic>reliability</topic><topic>Reproducibility</topic><topic>Resistivity</topic><topic>retention</topic><topic>Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices</topic><topic>Solids</topic><topic>Stability</topic><topic>Storage and reproduction of information</topic><topic>Stores</topic><topic>Testing</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Symanczyk, R.</creatorcontrib><creatorcontrib>Bruchhaus, R.</creatorcontrib><creatorcontrib>Dittrich, R.</creatorcontrib><creatorcontrib>Kund, M.</creatorcontrib><collection>IEEE All-Society Periodicals Package (ASPP) 2005-present</collection><collection>IEEE All-Society Periodicals Package (ASPP) 1998–Present</collection><collection>IEEE Xplore</collection><collection>Pascal-Francis</collection><collection>CrossRef</collection><collection>Electronics & Communications Abstracts</collection><collection>Technology Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><collection>ANTE: Abstracts in New Technology & Engineering</collection><collection>Engineering Research Database</collection><jtitle>IEEE electron device letters</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Symanczyk, R.</au><au>Bruchhaus, R.</au><au>Dittrich, R.</au><au>Kund, M.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Investigation of the Reliability Behavior of Conductive-Bridging Memory Cells</atitle><jtitle>IEEE electron device letters</jtitle><stitle>LED</stitle><date>2009-08-01</date><risdate>2009</risdate><volume>30</volume><issue>8</issue><spage>876</spage><epage>878</epage><pages>876-878</pages><issn>0741-3106</issn><eissn>1558-0563</eissn><coden>EDLEDZ</coden><abstract>Conductive-bridging memory can store information as different resistance states even when not powered. In order to check reliability challenges for nonvolatile-memory applications, the data retention has to be tested carefully. This letter describes a new test scheme using electrical bias for acceleration and enables the fast recording of such detailed information. Experimental data for memory devices based on Ag:GeS 2 as the active-matrix material are presented. Excellent stability and reproducibility of the resistance states for more than 300 cycles are demonstrated in the temperature range from 25degC to 85degC. Based on the calculated activation energy, ten years of data retention is extrapolated.</abstract><cop>New York, NY</cop><pub>IEEE</pub><doi>10.1109/LED.2009.2024623</doi><tpages>3</tpages></addata></record> |
fulltext | fulltext |
identifier | ISSN: 0741-3106 |
ispartof | IEEE electron device letters, 2009-08, Vol.30 (8), p.876-878 |
issn | 0741-3106 1558-0563 |
language | eng |
recordid | cdi_ieee_primary_5161279 |
source | IEEE Xplore (Online service) |
subjects | Active matrix technology Applied sciences Bridges CBRAM chalcogenide Conducting materials Data storage Design. Technologies. Operation analysis. Testing Electric resistance Electrodes Electronics Exact sciences and technology Extrapolation Integrated circuits Integrated circuits by function (including memories and processors) Life estimation Magnetic and optical mass memories Mathematical analysis Memory devices Nonvolatile memory Recording reliability Reproducibility Resistivity retention Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Solids Stability Storage and reproduction of information Stores Testing |
title | Investigation of the Reliability Behavior of Conductive-Bridging Memory Cells |
url | http://sfxeu10.hosted.exlibrisgroup.com/loughborough?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-28T10%3A46%3A33IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest_ieee_&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Investigation%20of%20the%20Reliability%20Behavior%20of%20Conductive-Bridging%20Memory%20Cells&rft.jtitle=IEEE%20electron%20device%20letters&rft.au=Symanczyk,%20R.&rft.date=2009-08-01&rft.volume=30&rft.issue=8&rft.spage=876&rft.epage=878&rft.pages=876-878&rft.issn=0741-3106&rft.eissn=1558-0563&rft.coden=EDLEDZ&rft_id=info:doi/10.1109/LED.2009.2024623&rft_dat=%3Cproquest_ieee_%3E2543453241%3C/proquest_ieee_%3E%3Cgrp_id%3Ecdi_FETCH-LOGICAL-c383t-96c68d55d6b54fac434f7e9ef4c79135273de35b0f08832f5a853fe2477d6e803%3C/grp_id%3E%3Coa%3E%3C/oa%3E%3Curl%3E%3C/url%3E&rft_id=info:oai/&rft_pqid=912026539&rft_id=info:pmid/&rft_ieee_id=5161279&rfr_iscdi=true |