A PC program that generates a model of the parasitics for BGA packages

The Package Parasitic Model Program is a PC program, that can generate a model of the parasitics for either two layer low cost BGA packages or for multi-layer high performance BGA packages. The user enters simple dimensional information for the geometry's of the package from the package drawing...

Full description

Saved in:
Bibliographic Details
Main Author: Caggiano, M.F.
Format: Conference Proceeding
Language:English
Subjects:
Bonding
Capacitance
Computer simulation
Costs
Equations
Inductance
Integrated circuit modeling
Integrated circuit packaging
Routing
SPICE
Online Access:Request full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:The Package Parasitic Model Program is a PC program, that can generate a model of the parasitics for either two layer low cost BGA packages or for multi-layer high performance BGA packages. The user enters simple dimensional information for the geometry's of the package from the package drawings. This information is easy to obtain from package dimensions or the program can default values for some of the more common dimensions, if their values are unknown. There are two files generated as outputs of the program. One file is a table containing all of the leads with each of the lead's parasitics listed along with the input data and some of the calculated dimensions. The other file generated is a "SPICE deck". This file contains all the leads' parasitics in the form of a circuit topology that can be used as input for a SPICE simulation. The Package Parasitic Model Program is helpful in integrated circuit package design and analysis by delivering a model of package parasitics within a few seconds. This program saves the time of tedious data entry required in the more sophisticated three dimensional programs that require large amounts of CPU time on work stations.
DOI:10.1109/ECTC.1995.517806