Reliability and analytical evaluations of no-clean flip-chip assembly

A process has been developed, qualified and implemented to replace traditional flip-chip (C4-Controlled Collapse Chip Connection) joining on ceramic carriers with a new no-clean technique. This important technical achievement overcomes existing cleaning limitations on attaching flip-chip C4's a...

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Bibliographic Details
Main Authors: Clementi, J.J., Dearing, G.O., Zimmerman, J.A., Bergeron, C.
Format: Conference Proceeding
Language:English
Subjects:
Assembly
Atmosphere
Ceramics
Cleaning
Copper
Joining processes
Lead
Manufacturing processes
Soldering
Temperature
Online Access:Request full text
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Description
Summary:A process has been developed, qualified and implemented to replace traditional flip-chip (C4-Controlled Collapse Chip Connection) joining on ceramic carriers with a new no-clean technique. This important technical achievement overcomes existing cleaning limitations on attaching flip-chip C4's at high melt soldering conditions. Previous no-clean assembly was limited to Direct Chip Attach (DCA) on organic substrates at low reflow eutectic (
ISSN:0569-5503
DOI:10.1109/ECTC.1995.517841