HIGH-DENSITY CMOS MULTICHIP-MODULE TESTING AND DIAGNOSIS

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Bibliographic Details
Main Authors: Bassett, R.W., Gillis, P.S., Shushereba, J.J.
Format: Conference Proceeding
Language:English
Subjects:
Assembly
Circuit testing
CMOS logic circuits
CMOS memory circuits
CMOS technology
Electronic packaging thermal management
Electronics packaging
Logic circuits
Pins
System performance
Online Access:Request full text
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Description
Summary:
ISSN:1089-3539
2378-2250
DOI:10.1109/TEST.1991.519715