Reflow soldering processes development using infrared thermography

Investigation deals with application of new kind of soldering equipment and development of reflow soldering processes for electronic devices using this equipment. It is based on low inert heaters for the middle IR spectral region. Due to low inertia of the heaters temperature changes in the solderin...

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Bibliographic Details
Main Authors: Mashkov, P., Pencheva, T., Gyoch, B.
Format: Conference Proceeding
Language:English
Subjects:
Belts
Cameras
Electronic components
Measurement techniques
Printed circuits
Reflow soldering
Soldering equipment
Temperature control
Temperature measurement
Temperature sensors
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Summary:Investigation deals with application of new kind of soldering equipment and development of reflow soldering processes for electronic devices using this equipment. It is based on low inert heaters for the middle IR spectral region. Due to low inertia of the heaters temperature changes in the soldering camera may be controlled precisely and the soldering cycle may be realized at the same place without conveyor belt. The printed circuit board (PCB) of the device is relatively big with different electronic components density in different zones of its surface. Used electronic components demand precise soldering cycle parameters realization. Temperature monitoring of the whole PCB's surface necessary for technological operation development practically is impossible by conventional measurement techniques. Good results are obtained using IR thermography with IR camera for the middle IR spectral region. Results of this investigation allow adjusting proper regime of operation of the soldering equipment and successful realization of soldering processes.
ISSN:2161-2528
DOI:10.1109/ISSE.2009.5207020