Some facts from lead-free solders reliability investigation

There are done many research works following investigation of lead-free solders, and differently results are achieved for identical solder materials. The reason is simple, the same solder compound can show diverse results when other material and process parameters are different. That is reason why w...

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Bibliographic Details
Main Authors: Szendiuch, I., Stary, J., Sandera, J., Bursik, M., Hejatkova, E.
Format: Conference Proceeding
Language:English
Subjects:
Consumer electronics
Cooling
Environmentally friendly manufacturing techniques
Joining materials
Lead
lead-free solder
Materials reliability
Materials testing
solder joint reliability testing
Soldering
solders joint structure formation
Stability
Temperature
wettability
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Summary:There are done many research works following investigation of lead-free solders, and differently results are achieved for identical solder materials. The reason is simple, the same solder compound can show diverse results when other material and process parameters are different. That is reason why we have addicted on investigation of some critical areas which has significant impact on solder joint reliability and lifetime. At length the soldering area should be divided in three principal parts that are materials and components, process and equipments, and design and testing. Our actual research work at Brno University of Technology is focused on soldering process parameters impact on solder joint structure, on wetting angle changes in dependence on material/process parameters and on thermo mechanical strain of soldered joints.