An investigation of the effect of grounding pads on power bus resonance characteristics

This paper describes the effect of grounding pads on power bus resonance characteristics in multilayer printed circuit boards (PCBs). The resonance characteristics of a four-layer PCB with and without grounding pads are investigated by full-wave simulation. The results show that the presence of the...

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Bibliographic Details
Main Authors: Morishita, K., Hubing, T., Xinbo He, Kobayashi, N., Harada, T.
Format: Conference Proceeding
Language:English
Subjects:
Circuit simulation
Circuit testing
Conductors
Fasteners
Grounding
Laboratories
Nonhomogeneous media
Printed circuits
Resonance
SPICE
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Description
Summary:This paper describes the effect of grounding pads on power bus resonance characteristics in multilayer printed circuit boards (PCBs). The resonance characteristics of a four-layer PCB with and without grounding pads are investigated by full-wave simulation. The results show that the presence of the grounding pads shifts the resonant frequencies significantly lower. The grounding pads can be modeled as a series LCR circuit for SPICE simulation. Using the SPICE model, the effect of the locations of the grounding pads on the resonance characteristics is investigated.
ISSN:2158-110X
2158-1118
DOI:10.1109/ISEMC.2009.5284693