Organic wafer-scale packaging for X-band SiGe low noise amplifier

This paper presents for the first time an organic Liquid Crystal Polymer (LCP) based System-on-Package module for an X-band SiGe low noise amplifier. The LNA is laminated with 2 mil LCP and via interconnects are fabricated. Measurements are made before and after packaging to ensure accurate comparis...

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Bibliographic Details
Main Authors: Patterson, Chad E., Thrivikraman, Tushar K., Bhattacharya, Swapan K., Poh, Chung Hang John, Cressler, John D., Papapolymerou, John
Format: Conference Proceeding
Language:English
Subjects:
Coplanar waveguides
Dielectric materials
Germanium silicon alloys
Low-noise amplifiers
Noise figure
Optical materials
Packaging
Radio frequency
Silicon germanium
Wafer scale integration
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Summary:This paper presents for the first time an organic Liquid Crystal Polymer (LCP) based System-on-Package module for an X-band SiGe low noise amplifier. The LNA is laminated with 2 mil LCP and via interconnects are fabricated. Measurements are made before and after packaging to ensure accurate comparison of amplifier performance. Before packaging, the LNA yielded 10.3 dB of gain, a minimum noise figure of 1.8 dB and a 50 Ω noise figure of 1.9dB. After packaging, there was a 0.1 dB of loss in gain output, a 0.1 dB increase in minimum noise figure and a 0.6 dB increase in 50 Ω noise figure. It is shown that thin layers of LCP can be successfully used in a wafer level packaging scheme for hybrid integration of SiGe RF electronics and organic packaging layers.
DOI:10.23919/EUMC.2009.5295965