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Demonstration of low temperature CMOS devices on SiOG and SOI substrates
The fabrication and analysis of CMOS devices fabricated on Silicon-on-Glass (SiOG) and compared to SOI (SIMOX) substrates are presented. Key aspects of the low temperature (< 600degC) fabrication process are described. The devices from the SiOG substrate were observed to be comparable to those fa...
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creator | Williams, C.K. Couillard, J.G. Senawiratne, J. Manley, R.G. Meller, P.M. Shea, C.G. McCabe, A.M. Hirschman, K.D. |
description | The fabrication and analysis of CMOS devices fabricated on Silicon-on-Glass (SiOG) and compared to SOI (SIMOX) substrates are presented. Key aspects of the low temperature (< 600degC) fabrication process are described. The devices from the SiOG substrate were observed to be comparable to those fabricated on SOI (SIMOX) with respect to carrier mobility and off-state leakage current. SiOG is viewed as a platform with potential applications in advanced flat panel mobile display modules as well as low-cost, medium performance ASICs. |
doi_str_mv | 10.1109/SOI.2009.5318791 |
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fullrecord | <record><control><sourceid>ieee_6IE</sourceid><recordid>TN_cdi_ieee_primary_5318791</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><ieee_id>5318791</ieee_id><sourcerecordid>5318791</sourcerecordid><originalsourceid>FETCH-LOGICAL-i90t-d9a6842612e85dbe6f5a4f024a3071339251ec74894707eec58c79a1c4d81db33</originalsourceid><addsrcrecordid>eNotUMtOwzAQNC-JUHpH4uIfSPCu7dg-ogBtpaIc0gO3ykk2UlCTVHEK4u-JoHMZaWZ2NRrGHkAkAMI9FfkmQSFcoiVY4-CC3YFCpTRK1JcsQm1MjOj01dlQqFNzzSIQxsYpwsctW4bwKWYoLYXVEVu_UDf0YRr91A49Hxp-GL75RN2RZuk0Es_e84LX9NVWFPgcKdp8xX1f87kOD6fy75bCPbtp_CHQ8swLtnt73WXreJuvNtnzNm6dmOLa-dQqTAHJ6rqktNFeNQKVl8KAlA41UGWUdcoIQ1RpWxnnoVK1hbqUcsEe_9-2RLQ_jm3nx5_9eRD5CxEsTrQ</addsrcrecordid><sourcetype>Publisher</sourcetype><iscdi>true</iscdi><recordtype>conference_proceeding</recordtype></control><display><type>conference_proceeding</type><title>Demonstration of low temperature CMOS devices on SiOG and SOI substrates</title><source>IEEE Electronic Library (IEL) Conference Proceedings</source><creator>Williams, C.K. ; Couillard, J.G. ; Senawiratne, J. ; Manley, R.G. ; Meller, P.M. ; Shea, C.G. ; McCabe, A.M. ; Hirschman, K.D.</creator><creatorcontrib>Williams, C.K. ; Couillard, J.G. ; Senawiratne, J. ; Manley, R.G. ; Meller, P.M. ; Shea, C.G. ; McCabe, A.M. ; Hirschman, K.D.</creatorcontrib><description>The fabrication and analysis of CMOS devices fabricated on Silicon-on-Glass (SiOG) and compared to SOI (SIMOX) substrates are presented. Key aspects of the low temperature (< 600degC) fabrication process are described. The devices from the SiOG substrate were observed to be comparable to those fabricated on SOI (SIMOX) with respect to carrier mobility and off-state leakage current. SiOG is viewed as a platform with potential applications in advanced flat panel mobile display modules as well as low-cost, medium performance ASICs.</description><identifier>ISSN: 1078-621X</identifier><identifier>ISBN: 1424442567</identifier><identifier>ISBN: 9781424442560</identifier><identifier>EISSN: 2577-2295</identifier><identifier>EISBN: 1424452325</identifier><identifier>EISBN: 9781424452323</identifier><identifier>DOI: 10.1109/SOI.2009.5318791</identifier><language>eng</language><publisher>IEEE</publisher><subject>CMOS process ; CMOS technology ; Dielectric substrates ; Etching ; Fabrication ; Glass ; Implants ; Silicon ; Temperature ; Thin film transistors</subject><ispartof>2009 IEEE International SOI Conference, 2009, p.1-2</ispartof><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/5318791$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>309,310,778,782,787,788,2054,27908,54538,54903,54915</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/5318791$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Williams, C.K.</creatorcontrib><creatorcontrib>Couillard, J.G.</creatorcontrib><creatorcontrib>Senawiratne, J.</creatorcontrib><creatorcontrib>Manley, R.G.</creatorcontrib><creatorcontrib>Meller, P.M.</creatorcontrib><creatorcontrib>Shea, C.G.</creatorcontrib><creatorcontrib>McCabe, A.M.</creatorcontrib><creatorcontrib>Hirschman, K.D.</creatorcontrib><title>Demonstration of low temperature CMOS devices on SiOG and SOI substrates</title><title>2009 IEEE International SOI Conference</title><addtitle>SOI</addtitle><description>The fabrication and analysis of CMOS devices fabricated on Silicon-on-Glass (SiOG) and compared to SOI (SIMOX) substrates are presented. Key aspects of the low temperature (< 600degC) fabrication process are described. The devices from the SiOG substrate were observed to be comparable to those fabricated on SOI (SIMOX) with respect to carrier mobility and off-state leakage current. SiOG is viewed as a platform with potential applications in advanced flat panel mobile display modules as well as low-cost, medium performance ASICs.</description><subject>CMOS process</subject><subject>CMOS technology</subject><subject>Dielectric substrates</subject><subject>Etching</subject><subject>Fabrication</subject><subject>Glass</subject><subject>Implants</subject><subject>Silicon</subject><subject>Temperature</subject><subject>Thin film transistors</subject><issn>1078-621X</issn><issn>2577-2295</issn><isbn>1424442567</isbn><isbn>9781424442560</isbn><isbn>1424452325</isbn><isbn>9781424452323</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2009</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><recordid>eNotUMtOwzAQNC-JUHpH4uIfSPCu7dg-ogBtpaIc0gO3ykk2UlCTVHEK4u-JoHMZaWZ2NRrGHkAkAMI9FfkmQSFcoiVY4-CC3YFCpTRK1JcsQm1MjOj01dlQqFNzzSIQxsYpwsctW4bwKWYoLYXVEVu_UDf0YRr91A49Hxp-GL75RN2RZuk0Es_e84LX9NVWFPgcKdp8xX1f87kOD6fy75bCPbtp_CHQ8swLtnt73WXreJuvNtnzNm6dmOLa-dQqTAHJ6rqktNFeNQKVl8KAlA41UGWUdcoIQ1RpWxnnoVK1hbqUcsEe_9-2RLQ_jm3nx5_9eRD5CxEsTrQ</recordid><startdate>200910</startdate><enddate>200910</enddate><creator>Williams, C.K.</creator><creator>Couillard, J.G.</creator><creator>Senawiratne, J.</creator><creator>Manley, R.G.</creator><creator>Meller, P.M.</creator><creator>Shea, C.G.</creator><creator>McCabe, A.M.</creator><creator>Hirschman, K.D.</creator><general>IEEE</general><scope>6IE</scope><scope>6IH</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIO</scope></search><sort><creationdate>200910</creationdate><title>Demonstration of low temperature CMOS devices on SiOG and SOI substrates</title><author>Williams, C.K. ; Couillard, J.G. ; Senawiratne, J. ; Manley, R.G. ; Meller, P.M. ; Shea, C.G. ; McCabe, A.M. ; Hirschman, K.D.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i90t-d9a6842612e85dbe6f5a4f024a3071339251ec74894707eec58c79a1c4d81db33</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2009</creationdate><topic>CMOS process</topic><topic>CMOS technology</topic><topic>Dielectric substrates</topic><topic>Etching</topic><topic>Fabrication</topic><topic>Glass</topic><topic>Implants</topic><topic>Silicon</topic><topic>Temperature</topic><topic>Thin film transistors</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Williams, C.K.</creatorcontrib><creatorcontrib>Couillard, J.G.</creatorcontrib><creatorcontrib>Senawiratne, J.</creatorcontrib><creatorcontrib>Manley, R.G.</creatorcontrib><creatorcontrib>Meller, P.M.</creatorcontrib><creatorcontrib>Shea, C.G.</creatorcontrib><creatorcontrib>McCabe, A.M.</creatorcontrib><creatorcontrib>Hirschman, K.D.</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan (POP) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Electronic Library (IEL)</collection><collection>IEEE Proceedings Order Plans (POP) 1998-present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Williams, C.K.</au><au>Couillard, J.G.</au><au>Senawiratne, J.</au><au>Manley, R.G.</au><au>Meller, P.M.</au><au>Shea, C.G.</au><au>McCabe, A.M.</au><au>Hirschman, K.D.</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>Demonstration of low temperature CMOS devices on SiOG and SOI substrates</atitle><btitle>2009 IEEE International SOI Conference</btitle><stitle>SOI</stitle><date>2009-10</date><risdate>2009</risdate><spage>1</spage><epage>2</epage><pages>1-2</pages><issn>1078-621X</issn><eissn>2577-2295</eissn><isbn>1424442567</isbn><isbn>9781424442560</isbn><eisbn>1424452325</eisbn><eisbn>9781424452323</eisbn><abstract>The fabrication and analysis of CMOS devices fabricated on Silicon-on-Glass (SiOG) and compared to SOI (SIMOX) substrates are presented. Key aspects of the low temperature (< 600degC) fabrication process are described. The devices from the SiOG substrate were observed to be comparable to those fabricated on SOI (SIMOX) with respect to carrier mobility and off-state leakage current. SiOG is viewed as a platform with potential applications in advanced flat panel mobile display modules as well as low-cost, medium performance ASICs.</abstract><pub>IEEE</pub><doi>10.1109/SOI.2009.5318791</doi><tpages>2</tpages></addata></record> |
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subjects | CMOS process CMOS technology Dielectric substrates Etching Fabrication Glass Implants Silicon Temperature Thin film transistors |
title | Demonstration of low temperature CMOS devices on SiOG and SOI substrates |
url | http://sfxeu10.hosted.exlibrisgroup.com/loughborough?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-16T21%3A50%3A48IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-ieee_6IE&rft_val_fmt=info:ofi/fmt:kev:mtx:book&rft.genre=proceeding&rft.atitle=Demonstration%20of%20low%20temperature%20CMOS%20devices%20on%20SiOG%20and%20SOI%20substrates&rft.btitle=2009%20IEEE%20International%20SOI%20Conference&rft.au=Williams,%20C.K.&rft.date=2009-10&rft.spage=1&rft.epage=2&rft.pages=1-2&rft.issn=1078-621X&rft.eissn=2577-2295&rft.isbn=1424442567&rft.isbn_list=9781424442560&rft_id=info:doi/10.1109/SOI.2009.5318791&rft.eisbn=1424452325&rft.eisbn_list=9781424452323&rft_dat=%3Cieee_6IE%3E5318791%3C/ieee_6IE%3E%3Cgrp_id%3Ecdi_FETCH-LOGICAL-i90t-d9a6842612e85dbe6f5a4f024a3071339251ec74894707eec58c79a1c4d81db33%3C/grp_id%3E%3Coa%3E%3C/oa%3E%3Curl%3E%3C/url%3E&rft_id=info:oai/&rft_id=info:pmid/&rft_ieee_id=5318791&rfr_iscdi=true |