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Demonstration of low temperature CMOS devices on SiOG and SOI substrates

The fabrication and analysis of CMOS devices fabricated on Silicon-on-Glass (SiOG) and compared to SOI (SIMOX) substrates are presented. Key aspects of the low temperature (< 600degC) fabrication process are described. The devices from the SiOG substrate were observed to be comparable to those fa...

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Main Authors: Williams, C.K., Couillard, J.G., Senawiratne, J., Manley, R.G., Meller, P.M., Shea, C.G., McCabe, A.M., Hirschman, K.D.
Format: Conference Proceeding
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creator Williams, C.K.
Couillard, J.G.
Senawiratne, J.
Manley, R.G.
Meller, P.M.
Shea, C.G.
McCabe, A.M.
Hirschman, K.D.
description The fabrication and analysis of CMOS devices fabricated on Silicon-on-Glass (SiOG) and compared to SOI (SIMOX) substrates are presented. Key aspects of the low temperature (< 600degC) fabrication process are described. The devices from the SiOG substrate were observed to be comparable to those fabricated on SOI (SIMOX) with respect to carrier mobility and off-state leakage current. SiOG is viewed as a platform with potential applications in advanced flat panel mobile display modules as well as low-cost, medium performance ASICs.
doi_str_mv 10.1109/SOI.2009.5318791
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subjects CMOS process
CMOS technology
Dielectric substrates
Etching
Fabrication
Glass
Implants
Silicon
Temperature
Thin film transistors
title Demonstration of low temperature CMOS devices on SiOG and SOI substrates
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