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Upgraded EMC modelling of dual die structure

Due to the variety of internal structures applied in different processors, EMC modelling should also be upgraded correspondingly. This paper presents an upgraded EMC simulation model of dual die structure which is originated from the IEEE electromagnetic challenging problem 2000-4 for conventional C...

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Bibliographic Details
Main Authors: Boyuan Zhu, Junwei Lu, Stegen, S., Erping Li
Format: Conference Proceeding
Language:English
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Summary:Due to the variety of internal structures applied in different processors, EMC modelling should also be upgraded correspondingly. This paper presents an upgraded EMC simulation model of dual die structure which is originated from the IEEE electromagnetic challenging problem 2000-4 for conventional CPU with heatsink. The simulation results are verified by measurement with a fabricated model. Furthermore, a consequent benchmark will be provided.
DOI:10.1109/EMCSA.2009.5349765