System-on-System (SoS) architecture for 3-D secure imaging

This paper presents an integrated approach towards a multilayered architecture based upon stacked silicon dies for image capture and secure image transmission. The System-on-System approach presented comprises CMOS imager, memory, 3-D DWT, 3-D AES and RF transmitter layer. Chips fabricated by differ...

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Bibliographic Details
Main Authors: Lee Sang-Jin, Park Kyung-Chang, Kim Yeon-Ho, Hong Yun-ki, You Younggap, Cho Kyoung-Rok, Cho Tae Won, Eshraghian, K.
Format: Conference Proceeding
Language:English
Subjects:
Cryptography
Discrete wavelet transforms
Energy consumption
Image coding
Image communication
Power system interconnection
Radio frequency
Silicon
Through-silicon vias
Transmitters
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Description
Summary:This paper presents an integrated approach towards a multilayered architecture based upon stacked silicon dies for image capture and secure image transmission. The System-on-System approach presented comprises CMOS imager, memory, 3-D DWT, 3-D AES and RF transmitter layer. Chips fabricated by different processes are stacked and interconnected using TSV. Compressed images from 3-D DWT are encrypted. The TSV interconnections reduce the number of output buffers and thereby reduce power consumption. The system can be implemented as a core of portable devices for image capture and secure transmission.
ISSN:2164-1676
2164-1706
DOI:10.1109/SOCCON.2009.5397999