Modification of textured silicon wafer surface morphology for fabrication of heterojunction solar cell with open circuit voltage over 700 mV

Crystalline silicon wafer (c-Si) can be extremely well passivated by plasma enhanced chemical vapor deposited (PECVD) amorphous silicon (a-Si:H) films. As a result, on flat substrates, solar cells with very high open circuit voltage are readily obtained. On textured substrates however the passivatio...

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Bibliographic Details
Main Authors: Fesquet, L., Olibet, S., Damon-Lacoste, J., De Wolf, S., Hessler-Wyser, A., Monachon, C., Ballif, C.
Format: Conference Proceeding
Language:English
Subjects:
Chemicals
Circuits
Fabrication
Heterojunctions
Photovoltaic cells
Silicon
Surface morphology
Surface texture
Surface treatment
Voltage
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Summary:Crystalline silicon wafer (c-Si) can be extremely well passivated by plasma enhanced chemical vapor deposited (PECVD) amorphous silicon (a-Si:H) films. As a result, on flat substrates, solar cells with very high open circuit voltage are readily obtained. On textured substrates however the passivation is more cumbersome, likely due to the presence of localized recombinative paths situated at the pyramid valleys. Here, we show that this issue may be resolved by selecting a silicon substrate morphology featuring large pyramids. Chemical post-texturization treatments can further reduce the surface recombination velocity. This sequence has allowed us to fabricate solar cells with open circuit voltage over 700 mV, demonstrating also on device level the effect of pyramid density and surface micro-roughness on the surface passivation quality.
ISSN:0160-8371
DOI:10.1109/PVSC.2009.5411173