Atmospheric-pressure plasma deposition of indium tin oxide

Indium tin oxide (ITO) films were deposited via atmospheric-pressure plasma-enhanced chemical vapor deposition (APPD) using indium acetylacetonate, indium trifluoroacetylacetonate and tin trifluoroacetylacetonate as metal-organic precursors. A film growth temperature of 300°C gave highly-transparent...

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Main Authors: Johnson, K., Guruvenket, S., Jha, S., Halverson, B., Olson, C., Sailer, R.A., Pokhodnya, K., Schulz, D.L.
Format: Conference Proceeding
Language:English
Subjects:
Annealing
Atmospheric-pressure plasmas
Chemical vapor deposition
Conductive films
Conductivity
Indium tin oxide
Plasma applications
Plasma chemistry
Plasma temperature
Thermal resistance
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creator Johnson, K.
Guruvenket, S.
Jha, S.
Halverson, B.
Olson, C.
Sailer, R.A.
Pokhodnya, K.
Schulz, D.L.
description Indium tin oxide (ITO) films were deposited via atmospheric-pressure plasma-enhanced chemical vapor deposition (APPD) using indium acetylacetonate, indium trifluoroacetylacetonate and tin trifluoroacetylacetonate as metal-organic precursors. A film growth temperature of 300°C gave highly-transparent films with modest conductivity. Post-deposition thermal treatments gave ITO films with resistivities one to two orders of magnitude higher than those available commercially. Compositional analysis revealed a high carbon content and annealing the films in oxygen at 400 C did not affect the C concentration. A decrease in the fluorine content in the films was observed after annealing with and the onset of crystallization was noted via XRD.
doi_str_mv 10.1109/PVSC.2009.5411492
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source IEEE Electronic Library (IEL) Conference Proceedings
subjects Annealing
Atmospheric-pressure plasmas
Chemical vapor deposition
Conductive films
Conductivity
Indium tin oxide
Plasma applications
Plasma chemistry
Plasma temperature
Thermal resistance
title Atmospheric-pressure plasma deposition of indium tin oxide
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