Technology roadmapping for Power Supply in Package (PSiP) and Power Supply on Chip (PwrSoC)

• Main Authors: Foley, R., Waldron, F., Slowey, J., Alderman, A., Narveson, B., O'Mathuna, S.C.
• Format: Conference Proceeding
• Language: English
• Subjects: Assembly; Computer displays; Costs; Educational institutions; Electricity supply industry; Performance analysis; Power conversion; Power supplies; Semiconductor device packaging; Space technology
• ISSN: 1048-2334; 2470-6647
• DOI: 10.1109/APEC.2010.5433622

This paper presents a review and summary of the PSMA ¿PSiP2PwrSoC¿ Special Project that investigated the technology and performance underpinning recent commercial developments in Power Supply in Package and Power Supply on Chip. The results of the study are based on the identification of more than 28 commercial products, 6 of which were analyzed in detail, both physically and electrically. The methodology of the project is described and some of the salient results of this benchmarking effort are presented. In this work, a representative subset of the available commercial products was selected and a comprehensive physical, electrical and thermal performance analysis was carried out. The main aims of this analysis were to identify the components, materials and assembly technologies used, and to determine if the drive towards greater integration and higher power density affected the performance of newer devices. The results of the analysis were then used to determine the current state of the technology in this application space, to show how it has developed to date and to predict how it might progress in the future. These results are presented in a generic format that does not identify individual products. This project was co-sponsored by the PSMA and member companies. The final report of the project, which includes more detailed information on the reviews described here as well as considerable trending analysis, is now available.