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Study of LDD Implantation Influence on ESD Failure Threshold using Electrothermal Simulation
In CMOS technologies, hardness to ESD events is becoming a major reliability issue. In this context, NMOS transistors are particularly sensible. This study focus on the influence of LDD implantation on ESD failure threshold. ESD tests performed on elementary devices demonstrate the lower performance...
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creator | Leroux, C. Buj, C. Chante, J-P. |
description | In CMOS technologies, hardness to ESD events is becoming a major reliability issue. In this context, NMOS transistors are particularly sensible. This study focus on the influence of LDD implantation on ESD failure threshold. ESD tests performed on elementary devices demonstrate the lower performance of LDD transistors. For NMOS transistors with and without LDD, electrothermal simulation have been performed, they lead to results similar to experimental ones, and give an explanation for greater heating in gradual junction. |
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In this context, NMOS transistors are particularly sensible. This study focus on the influence of LDD implantation on ESD failure threshold. ESD tests performed on elementary devices demonstrate the lower performance of LDD transistors. For NMOS transistors with and without LDD, electrothermal simulation have been performed, they lead to results similar to experimental ones, and give an explanation for greater heating in gradual junction.</description><identifier>ISBN: 9782863321829</identifier><identifier>ISBN: 286332182X</identifier><language>eng</language><publisher>IEEE</publisher><subject>Breakdown voltage ; CMOS technology ; Electrostatic discharge ; Electrothermal effects ; Heating ; MOS devices ; MOSFETs ; Performance evaluation ; Temperature ; Testing</subject><ispartof>ESSDERC '95: Proceedings of the 25th European Solid State Device Research Conference, 1995, p.321-324</ispartof><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/5435888$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>309,310,780,784,789,790,2058,54920</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/5435888$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Leroux, C.</creatorcontrib><creatorcontrib>Buj, C.</creatorcontrib><creatorcontrib>Chante, J-P.</creatorcontrib><title>Study of LDD Implantation Influence on ESD Failure Threshold using Electrothermal Simulation</title><title>ESSDERC '95: Proceedings of the 25th European Solid State Device Research Conference</title><addtitle>ESSDERC</addtitle><description>In CMOS technologies, hardness to ESD events is becoming a major reliability issue. In this context, NMOS transistors are particularly sensible. This study focus on the influence of LDD implantation on ESD failure threshold. ESD tests performed on elementary devices demonstrate the lower performance of LDD transistors. For NMOS transistors with and without LDD, electrothermal simulation have been performed, they lead to results similar to experimental ones, and give an explanation for greater heating in gradual junction.</description><subject>Breakdown voltage</subject><subject>CMOS technology</subject><subject>Electrostatic discharge</subject><subject>Electrothermal effects</subject><subject>Heating</subject><subject>MOS devices</subject><subject>MOSFETs</subject><subject>Performance evaluation</subject><subject>Temperature</subject><subject>Testing</subject><isbn>9782863321829</isbn><isbn>286332182X</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>1995</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><recordid>eNotjs1qhDAYRQOl0DL1CbrJCwjR_C_L6LTCQBe6HBii-VJTog4xLubtK21Xl3MWh_uAMi1VqQSlZaFK_YSydf0mhBRa6ILxZ3Rp02bveHH4XFW4mW7BzMkkv8y4mV3YYB4A71C3FT4ZH7YIuBsjrOMSLN5WP3_hOsCQ4pJGiJMJuPXTFn4TL-jRmbBC9r8H1J3q7viRnz_fm-PbOfeapJyXBUhJtO0pJ0LaXrMe2P6WgBLClk46yZSDQTspeF-YQRsqCd216q1l9IBe_7IeAK636CcT71fOKFdK0R_0gkyt</recordid><startdate>199509</startdate><enddate>199509</enddate><creator>Leroux, C.</creator><creator>Buj, C.</creator><creator>Chante, J-P.</creator><general>IEEE</general><scope>6IE</scope><scope>6IL</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIL</scope></search><sort><creationdate>199509</creationdate><title>Study of LDD Implantation Influence on ESD Failure Threshold using Electrothermal Simulation</title><author>Leroux, C. ; Buj, C. ; Chante, J-P.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i90t-521e7709db35067db94be48290e866d2f7f748fec9f765b1ac9a37037f78bdd43</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>1995</creationdate><topic>Breakdown voltage</topic><topic>CMOS technology</topic><topic>Electrostatic discharge</topic><topic>Electrothermal effects</topic><topic>Heating</topic><topic>MOS devices</topic><topic>MOSFETs</topic><topic>Performance evaluation</topic><topic>Temperature</topic><topic>Testing</topic><toplevel>online_resources</toplevel><creatorcontrib>Leroux, C.</creatorcontrib><creatorcontrib>Buj, C.</creatorcontrib><creatorcontrib>Chante, J-P.</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan All Online (POP All Online) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Xplore</collection><collection>IEEE Proceedings Order Plans (POP All) 1998-Present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Leroux, C.</au><au>Buj, C.</au><au>Chante, J-P.</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>Study of LDD Implantation Influence on ESD Failure Threshold using Electrothermal Simulation</atitle><btitle>ESSDERC '95: Proceedings of the 25th European Solid State Device Research Conference</btitle><stitle>ESSDERC</stitle><date>1995-09</date><risdate>1995</risdate><spage>321</spage><epage>324</epage><pages>321-324</pages><isbn>9782863321829</isbn><isbn>286332182X</isbn><abstract>In CMOS technologies, hardness to ESD events is becoming a major reliability issue. In this context, NMOS transistors are particularly sensible. This study focus on the influence of LDD implantation on ESD failure threshold. ESD tests performed on elementary devices demonstrate the lower performance of LDD transistors. For NMOS transistors with and without LDD, electrothermal simulation have been performed, they lead to results similar to experimental ones, and give an explanation for greater heating in gradual junction.</abstract><pub>IEEE</pub><tpages>4</tpages></addata></record> |
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source | IEEE Electronic Library (IEL) Conference Proceedings |
subjects | Breakdown voltage CMOS technology Electrostatic discharge Electrothermal effects Heating MOS devices MOSFETs Performance evaluation Temperature Testing |
title | Study of LDD Implantation Influence on ESD Failure Threshold using Electrothermal Simulation |
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