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Annealing of Hot Carrier Damaged Double Metal MOSFET
The annealing of damage induced by static hot carrier aging on double metal AMOS devices was investigated. To get more insight about the nature of hot carrier damage a new experimental approach is proposed: devices were subjected to cycles of hot carrier stress, followed by annealing at fixed temper...
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creator | Annunziata, R. Libera, G. Dalla Ghio, E. Maggis, A. |
description | The annealing of damage induced by static hot carrier aging on double metal AMOS devices was investigated. To get more insight about the nature of hot carrier damage a new experimental approach is proposed: devices were subjected to cycles of hot carrier stress, followed by annealing at fixed temperature. The activation energy for the bake recovery of parameters was evaluated. The method allows to distinguish between permanent and recoverable hot carrier effects. The recovery kinetics Suggests that the prevailing degradation source is electron trapping into shallow interface states induced by double metal processing. |
doi_str_mv | 10.1007/978-3-642-52314-4_150 |
format | conference_proceeding |
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The recovery kinetics Suggests that the prevailing degradation source is electron trapping into shallow interface states induced by double metal processing.</description><identifier>ISBN: 9780387510002</identifier><identifier>ISBN: 0387510001</identifier><identifier>DOI: 10.1007/978-3-642-52314-4_150</identifier><language>eng</language><publisher>IEEE</publisher><subject>Aging ; Annealing ; Degradation ; Electrons ; Hot carrier effects ; Hot carriers ; Kinetic theory ; MOSFET circuits ; Stress ; Temperature</subject><ispartof>ESSDERC '89: 19th European Solid State Device Research Conference, 1989, p.715-718</ispartof><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/5436500$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>309,310,780,784,789,790,2058,27925,54920</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/5436500$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Annunziata, R.</creatorcontrib><creatorcontrib>Libera, G. Dalla</creatorcontrib><creatorcontrib>Ghio, E.</creatorcontrib><creatorcontrib>Maggis, A.</creatorcontrib><title>Annealing of Hot Carrier Damaged Double Metal MOSFET</title><title>ESSDERC '89: 19th European Solid State Device Research Conference</title><addtitle>ESSDERC</addtitle><description>The annealing of damage induced by static hot carrier aging on double metal AMOS devices was investigated. To get more insight about the nature of hot carrier damage a new experimental approach is proposed: devices were subjected to cycles of hot carrier stress, followed by annealing at fixed temperature. The activation energy for the bake recovery of parameters was evaluated. The method allows to distinguish between permanent and recoverable hot carrier effects. The recovery kinetics Suggests that the prevailing degradation source is electron trapping into shallow interface states induced by double metal processing.</description><subject>Aging</subject><subject>Annealing</subject><subject>Degradation</subject><subject>Electrons</subject><subject>Hot carrier effects</subject><subject>Hot carriers</subject><subject>Kinetic theory</subject><subject>MOSFET circuits</subject><subject>Stress</subject><subject>Temperature</subject><isbn>9780387510002</isbn><isbn>0387510001</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>1989</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><recordid>eNotjFFLwzAUhQMiKLO_QIT8gehN7k2TPI5O3WBjD-69JGk2Kl0raX3w3xvQp3P4zsdh7EnCswQwL85YgaImJbRCSYJaqeGGVYUDWqOLBOqOVfP8WRqQlsriPaP1OCY_9OOFT2e-nRbe-Jz7lPnGX_0ldXwzfYch8UNa_MAPx4-319MDuz37YU7Vf67YqdBmK_bH912z3ovewSKcR62sC1paVYMh5zTaOiaMHqSSwVIgAmcCmuSid5HKoLrixy50IeKKPf7d9iml9iv3V59_Wk1YawD8BbF4QjE</recordid><startdate>198909</startdate><enddate>198909</enddate><creator>Annunziata, R.</creator><creator>Libera, G. 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Dalla ; Ghio, E. ; Maggis, A.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i90t-9a35289b51826074995386ce3ca0121b84b44097b37e9ca9c4ca02db51cdbdbc3</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>1989</creationdate><topic>Aging</topic><topic>Annealing</topic><topic>Degradation</topic><topic>Electrons</topic><topic>Hot carrier effects</topic><topic>Hot carriers</topic><topic>Kinetic theory</topic><topic>MOSFET circuits</topic><topic>Stress</topic><topic>Temperature</topic><toplevel>online_resources</toplevel><creatorcontrib>Annunziata, R.</creatorcontrib><creatorcontrib>Libera, G. Dalla</creatorcontrib><creatorcontrib>Ghio, E.</creatorcontrib><creatorcontrib>Maggis, A.</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan All Online (POP All Online) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE/IET Electronic Library (IEL)</collection><collection>IEEE Proceedings Order Plans (POP All) 1998-Present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Annunziata, R.</au><au>Libera, G. Dalla</au><au>Ghio, E.</au><au>Maggis, A.</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>Annealing of Hot Carrier Damaged Double Metal MOSFET</atitle><btitle>ESSDERC '89: 19th European Solid State Device Research Conference</btitle><stitle>ESSDERC</stitle><date>1989-09</date><risdate>1989</risdate><spage>715</spage><epage>718</epage><pages>715-718</pages><isbn>9780387510002</isbn><isbn>0387510001</isbn><abstract>The annealing of damage induced by static hot carrier aging on double metal AMOS devices was investigated. To get more insight about the nature of hot carrier damage a new experimental approach is proposed: devices were subjected to cycles of hot carrier stress, followed by annealing at fixed temperature. The activation energy for the bake recovery of parameters was evaluated. The method allows to distinguish between permanent and recoverable hot carrier effects. The recovery kinetics Suggests that the prevailing degradation source is electron trapping into shallow interface states induced by double metal processing.</abstract><pub>IEEE</pub><doi>10.1007/978-3-642-52314-4_150</doi><tpages>4</tpages></addata></record> |
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ispartof | ESSDERC '89: 19th European Solid State Device Research Conference, 1989, p.715-718 |
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language | eng |
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source | IEEE Electronic Library (IEL) Conference Proceedings |
subjects | Aging Annealing Degradation Electrons Hot carrier effects Hot carriers Kinetic theory MOSFET circuits Stress Temperature |
title | Annealing of Hot Carrier Damaged Double Metal MOSFET |
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