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Compacting of various metal, alloy and ceramic powder using 20 kHz ultrasonic vibration compacting equipments with upper and lower vibration punches

-20 kHz ultrasonic vibration compacting system with 15-mm-diameter upper and lower vibration punches and a radial vibration die, and 20 kHz vibration compacting system using 5-mm-diameter upper and lower vibration punches are studied. Compacting of metal, alloy and ceramics powder is important proce...

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Main Authors: Tsujino, Jiromaru, Shimada, Noboru, Saotome, Yasunori, Sugimoto, Eiichi
Format: Conference Proceeding
Language:English
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creator Tsujino, Jiromaru
Shimada, Noboru
Saotome, Yasunori
Sugimoto, Eiichi
description -20 kHz ultrasonic vibration compacting system with 15-mm-diameter upper and lower vibration punches and a radial vibration die, and 20 kHz vibration compacting system using 5-mm-diameter upper and lower vibration punches are studied. Compacting of metal, alloy and ceramics powder is important process for powder metallurgy which is used for producing small and precise mechanical parts and required for various industry fields including electronics. Some complex metal alloy, amorphous alloy and fine ceramic powder such as zirconium are impossible to compact using only static pressure. Various powder are compacted with larger density and more uniform distribution compared that without vibration.
doi_str_mv 10.1109/ULTSYM.2009.5441788
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identifier ISSN: 1051-0117
ispartof 2009 IEEE International Ultrasonics Symposium, 2009, p.1985-1988
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language eng
recordid cdi_ieee_primary_5441788
source IEEE Electronic Library (IEL) Conference Proceedings
subjects 15-mm-diameter vibration compacting system
20 kHz compacting system:vibration punch
5-mm-diameter vibration compacting system
Ceramics
Detectors
Force measurement
Powders
Power amplifiers
Pressure measurement
Transducers
Ultrasonic variables measurement
ultrasonic vibration compacting of various powder
various vibration die
Vibration measurement
Zirconium
title Compacting of various metal, alloy and ceramic powder using 20 kHz ultrasonic vibration compacting equipments with upper and lower vibration punches
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