Interaction of scaling trends in processor architecture and cooling

It is predicted that two important trends are likely to accompany traditional CMOS semiconductor technology scaling - chip multiprocessors and 3D integration. With the ever-increasing power consumption and the consequent difficulty in heat removal, it is important to consider the limits and implicat...

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Bibliographic Details
Main Authors: Wei Huang, Stan, Mircea R, Gurumurthi, Sudhanva, Ribando, Robert J, Skadron, Kevin
Format: Conference Proceeding
Language:English
Subjects:
3D integration
CMOS technology
Computer architecture
Computer science
cooling solution
Liquid cooling
manycore architecture
Microchannel
Microprocessors
Moore's Law
Parallel processing
processors
Silicon
Technology scaling
Transistors
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Summary:It is predicted that two important trends are likely to accompany traditional CMOS semiconductor technology scaling - chip multiprocessors and 3D integration. With the ever-increasing power consumption and the consequent difficulty in heat removal, it is important to consider the limits and implications of different cooling methods for the upcoming many-core and 3D era. In this paper, we consider both technology scaling and many-core architecture scaling trends in conjunction with conventional air cooling and advanced microchannel cooling for both 2D and 3D microprocessors and identify interesting inflection design points down the road.
ISSN:1065-2221
2577-1000
DOI:10.1109/STHERM.2010.5444290