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Low power and high density optical interconnects for future supercomputers

Increasing performance in supercomputers requires a concomitant increase in intrasystem interconnect bandwidth. We review the status and prospects of technologies required to build low power, high density board and chip level interconnects.

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Bibliographic Details
Main Authors: Pepeljugoski, Petar, Kash, Jeffrey, Doany, Fuad, Kuchta, Daniel, Schares, Laurent, Schow, Clint, Taubenblatt, Marc, Offrein, Bert Jan, Benner, Alan
Format: Conference Proceeding
Language:English
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Description
Summary:Increasing performance in supercomputers requires a concomitant increase in intrasystem interconnect bandwidth. We review the status and prospects of technologies required to build low power, high density board and chip level interconnects.
DOI:10.1364/OFC.2010.OThX2