Loading…
Low power and high density optical interconnects for future supercomputers
Increasing performance in supercomputers requires a concomitant increase in intrasystem interconnect bandwidth. We review the status and prospects of technologies required to build low power, high density board and chip level interconnects.
Saved in:
Main Authors: | , , , , , , , , |
---|---|
Format: | Conference Proceeding |
Language: | English |
Subjects: | |
Online Access: | Request full text |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Summary: | Increasing performance in supercomputers requires a concomitant increase in intrasystem interconnect bandwidth. We review the status and prospects of technologies required to build low power, high density board and chip level interconnects. |
---|---|
DOI: | 10.1364/OFC.2010.OThX2 |