Release-control structure for post-process release of a micromachined cantilever

This paper presents a cost-effective method of obtaining intact, released oxide/poly cantilever beams (using bulk micromachining), within the constraints of simple post-processing of a standard CMOS fabrication process. Extensions to the basic cantilever are used to prevent the main oxide/poly beam...

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Bibliographic Details
Main Authors: Naseh, S., Landsberger, L.M., Paranjape, M., Nikpour, B., Kahrizi, M., Antaki, R., Currie, J.F.
Format: Conference Proceeding
Language:English
Subjects:
Actuators
Anisotropic magnetoresistance
CMOS process
Fabrication
Laboratories
Micromachining
Residual stresses
Silicon
Structural beams
Wet etching
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Summary:This paper presents a cost-effective method of obtaining intact, released oxide/poly cantilever beams (using bulk micromachining), within the constraints of simple post-processing of a standard CMOS fabrication process. Extensions to the basic cantilever are used to prevent the main oxide/poly beam from bending upwards until the main cantilever is completely released from the Si beneath. The cantilever and extensions are designed based on etch anisotropy in TMAH 25 wt% at 80/spl deg/C. The connection tether angles are designed to be at an angle where the underetch rate of the etchant is greatest.
ISSN:0840-7789
2576-7046
DOI:10.1109/CCECE.1996.548043