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PBTI response to interfacial layer thickness variation in Hf-based HKMG nFETs
The impact of SiO 2 interfacial layer (IL) thickness on the Positive Bias Temperature Instability (PBTI) is investigated for nMOSFETs with an IL/High-K/metal/poly-Si gate stack architecture. Results from extensive PBTI measurements using three different measurement methodologies consistently demonst...
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creator | Ioannou, D P Cartier, E Wang, Y Mittl, S |
description | The impact of SiO 2 interfacial layer (IL) thickness on the Positive Bias Temperature Instability (PBTI) is investigated for nMOSFETs with an IL/High-K/metal/poly-Si gate stack architecture. Results from extensive PBTI measurements using three different measurement methodologies consistently demonstrate that thickening the IL results in threshold voltage (V T ) instability reduction and thus significantly enhances PBTI device lifetime. The voltage acceleration is found to increase with thicker IL, while the PBTI fractional recovery is independent of the IL thickness, providing new insights into the PBTI buildup and recovery mechanisms. |
doi_str_mv | 10.1109/IRPS.2010.5488679 |
format | conference_proceeding |
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Results from extensive PBTI measurements using three different measurement methodologies consistently demonstrate that thickening the IL results in threshold voltage (V T ) instability reduction and thus significantly enhances PBTI device lifetime. The voltage acceleration is found to increase with thicker IL, while the PBTI fractional recovery is independent of the IL thickness, providing new insights into the PBTI buildup and recovery mechanisms.</description><identifier>ISSN: 1541-7026</identifier><identifier>ISBN: 1424454301</identifier><identifier>ISBN: 9781424454303</identifier><identifier>EISSN: 1938-1891</identifier><identifier>EISBN: 1424454298</identifier><identifier>EISBN: 9781424454297</identifier><identifier>EISBN: 9781424454310</identifier><identifier>EISBN: 142445431X</identifier><identifier>DOI: 10.1109/IRPS.2010.5488679</identifier><identifier>LCCN: 82-640313</identifier><language>eng</language><publisher>IEEE</publisher><subject>Electron traps ; Gate leakage ; HfO 2 ; High K dielectric materials ; High-k dielectrics ; High-K gate dielectrics ; interface ; layer ; metal gate ; Microelectronics ; MOSFETs ; PBTI ; PBTI recovery ; Research and development ; Stress ; Thickness measurement ; Voltage</subject><ispartof>2010 IEEE International Reliability Physics Symposium, 2010, p.1044-1048</ispartof><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/5488679$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>309,310,780,784,789,790,2056,27923,54553,54918,54930</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/5488679$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Ioannou, D P</creatorcontrib><creatorcontrib>Cartier, E</creatorcontrib><creatorcontrib>Wang, Y</creatorcontrib><creatorcontrib>Mittl, S</creatorcontrib><title>PBTI response to interfacial layer thickness variation in Hf-based HKMG nFETs</title><title>2010 IEEE International Reliability Physics Symposium</title><addtitle>IRPS</addtitle><description>The impact of SiO 2 interfacial layer (IL) thickness on the Positive Bias Temperature Instability (PBTI) is investigated for nMOSFETs with an IL/High-K/metal/poly-Si gate stack architecture. Results from extensive PBTI measurements using three different measurement methodologies consistently demonstrate that thickening the IL results in threshold voltage (V T ) instability reduction and thus significantly enhances PBTI device lifetime. The voltage acceleration is found to increase with thicker IL, while the PBTI fractional recovery is independent of the IL thickness, providing new insights into the PBTI buildup and recovery mechanisms.</description><subject>Electron traps</subject><subject>Gate leakage</subject><subject>HfO 2</subject><subject>High K dielectric materials</subject><subject>High-k dielectrics</subject><subject>High-K gate dielectrics</subject><subject>interface</subject><subject>layer</subject><subject>metal gate</subject><subject>Microelectronics</subject><subject>MOSFETs</subject><subject>PBTI</subject><subject>PBTI recovery</subject><subject>Research and development</subject><subject>Stress</subject><subject>Thickness measurement</subject><subject>Voltage</subject><issn>1541-7026</issn><issn>1938-1891</issn><isbn>1424454301</isbn><isbn>9781424454303</isbn><isbn>1424454298</isbn><isbn>9781424454297</isbn><isbn>9781424454310</isbn><isbn>142445431X</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2010</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><recordid>eNo9UMtOAjEUrQ8SEfkA46Y_UOxte_tYKkGYCJEorkkH7sQqDmQ6MeHvnUTi2ZycR87iMHYLcgQgw33xunwbKdlJNN5bF87YNRhlDBoV_DnrQ9BegA9w8R9oCZddgAaEk8r2WN8rYY3UoK_YMOdP2cGgssb02WL5uCp4Q_mwrzPxds9T3VJTxU2KO76LR2p4-5E2XzXlzH9ik2Kb9nXX4rNKlDHTls-eF1NeP01W-Yb1qrjLNDzxgL139ngm5i_TYvwwFwkctmKjqdRqqzT4MkivQrQylojSQIVhC6W1zqAmjY4qROeDdh7JokJbokQ9YHd_u4mI1ocmfcfmuD5dpH8BXS9Rfg</recordid><startdate>201005</startdate><enddate>201005</enddate><creator>Ioannou, D P</creator><creator>Cartier, E</creator><creator>Wang, Y</creator><creator>Mittl, S</creator><general>IEEE</general><scope>6IE</scope><scope>6IH</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIO</scope></search><sort><creationdate>201005</creationdate><title>PBTI response to interfacial layer thickness variation in Hf-based HKMG nFETs</title><author>Ioannou, D P ; Cartier, E ; Wang, Y ; Mittl, S</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i175t-c3eb32d2318b90829a60ab55041f59d1b667453e357ef557893785e65256b5053</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2010</creationdate><topic>Electron traps</topic><topic>Gate leakage</topic><topic>HfO 2</topic><topic>High K dielectric materials</topic><topic>High-k dielectrics</topic><topic>High-K gate dielectrics</topic><topic>interface</topic><topic>layer</topic><topic>metal gate</topic><topic>Microelectronics</topic><topic>MOSFETs</topic><topic>PBTI</topic><topic>PBTI recovery</topic><topic>Research and development</topic><topic>Stress</topic><topic>Thickness measurement</topic><topic>Voltage</topic><toplevel>online_resources</toplevel><creatorcontrib>Ioannou, D P</creatorcontrib><creatorcontrib>Cartier, E</creatorcontrib><creatorcontrib>Wang, Y</creatorcontrib><creatorcontrib>Mittl, S</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan (POP) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Xplore</collection><collection>IEEE Proceedings Order Plans (POP) 1998-present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Ioannou, D P</au><au>Cartier, E</au><au>Wang, Y</au><au>Mittl, S</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>PBTI response to interfacial layer thickness variation in Hf-based HKMG nFETs</atitle><btitle>2010 IEEE International Reliability Physics Symposium</btitle><stitle>IRPS</stitle><date>2010-05</date><risdate>2010</risdate><spage>1044</spage><epage>1048</epage><pages>1044-1048</pages><issn>1541-7026</issn><eissn>1938-1891</eissn><isbn>1424454301</isbn><isbn>9781424454303</isbn><eisbn>1424454298</eisbn><eisbn>9781424454297</eisbn><eisbn>9781424454310</eisbn><eisbn>142445431X</eisbn><abstract>The impact of SiO 2 interfacial layer (IL) thickness on the Positive Bias Temperature Instability (PBTI) is investigated for nMOSFETs with an IL/High-K/metal/poly-Si gate stack architecture. Results from extensive PBTI measurements using three different measurement methodologies consistently demonstrate that thickening the IL results in threshold voltage (V T ) instability reduction and thus significantly enhances PBTI device lifetime. The voltage acceleration is found to increase with thicker IL, while the PBTI fractional recovery is independent of the IL thickness, providing new insights into the PBTI buildup and recovery mechanisms.</abstract><pub>IEEE</pub><doi>10.1109/IRPS.2010.5488679</doi><tpages>5</tpages></addata></record> |
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source | IEEE Xplore All Conference Series |
subjects | Electron traps Gate leakage HfO 2 High K dielectric materials High-k dielectrics High-K gate dielectrics interface layer metal gate Microelectronics MOSFETs PBTI PBTI recovery Research and development Stress Thickness measurement Voltage |
title | PBTI response to interfacial layer thickness variation in Hf-based HKMG nFETs |
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