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Root cause study on lid adhesion failure
This paper studied the factors causing adhesion failure between lid and adhesive. Adhesive curing mechanism has been experimentally investigated in combination of surface behaviour analysis on lid by using FTIR and XPS. The results showed residue on lid surface caused by low water rinse flow can aff...
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creator | Ong, M C Zhao, X L Zee, B Joman, P P Chin, J M Master, Raj N |
description | This paper studied the factors causing adhesion failure between lid and adhesive. Adhesive curing mechanism has been experimentally investigated in combination of surface behaviour analysis on lid by using FTIR and XPS. The results showed residue on lid surface caused by low water rinse flow can affect the curing condition. |
doi_str_mv | 10.1109/IEMT.2008.5507812 |
format | conference_proceeding |
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Adhesive curing mechanism has been experimentally investigated in combination of surface behaviour analysis on lid by using FTIR and XPS. The results showed residue on lid surface caused by low water rinse flow can affect the curing condition.</abstract><pub>IEEE</pub><doi>10.1109/IEMT.2008.5507812</doi><tpages>5</tpages></addata></record> |
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identifier | ISSN: 1089-8190 |
ispartof | 2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT), 2008, p.1-5 |
issn | 1089-8190 2576-9626 |
language | eng |
recordid | cdi_ieee_primary_5507812 |
source | IEEE Electronic Library (IEL) Conference Proceedings |
subjects | Adhesives Bonding forces Curing Flanges Manufacturing Ovens Packaging Sealing materials Spectroscopy Tiles |
title | Root cause study on lid adhesion failure |
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