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Root cause study on lid adhesion failure

This paper studied the factors causing adhesion failure between lid and adhesive. Adhesive curing mechanism has been experimentally investigated in combination of surface behaviour analysis on lid by using FTIR and XPS. The results showed residue on lid surface caused by low water rinse flow can aff...

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Main Authors: Ong, M C, Zhao, X L, Zee, B, Joman, P P, Chin, J M, Master, Raj N
Format: Conference Proceeding
Language:English
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creator Ong, M C
Zhao, X L
Zee, B
Joman, P P
Chin, J M
Master, Raj N
description This paper studied the factors causing adhesion failure between lid and adhesive. Adhesive curing mechanism has been experimentally investigated in combination of surface behaviour analysis on lid by using FTIR and XPS. The results showed residue on lid surface caused by low water rinse flow can affect the curing condition.
doi_str_mv 10.1109/IEMT.2008.5507812
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identifier ISSN: 1089-8190
ispartof 2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT), 2008, p.1-5
issn 1089-8190
2576-9626
language eng
recordid cdi_ieee_primary_5507812
source IEEE Electronic Library (IEL) Conference Proceedings
subjects Adhesives
Bonding forces
Curing
Flanges
Manufacturing
Ovens
Packaging
Sealing materials
Spectroscopy
Tiles
title Root cause study on lid adhesion failure
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