Ultra compact RFICs using three-dimensional MMIC technology

Since the 1980s, NTT has been developing three- dimensional (3D) monolith microwave integrated circuits (MMICs) to achieve small-size and low-cost ICs. The usage of 3D MMICs is a very powerful technique, especially at quasi-millimeter and millimeter wave. We describe the structure and features of 3D...

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Bibliographic Details
Main Authors: Kaho, T., Yamaguchi, Y., Nishikawa, K., Toyoda, I., Uehara, K.
Format: Conference Proceeding
Language:English
Subjects:
Integrated circuit technology
Microwave integrated circuits
Microwave technology
Millimeter wave integrated circuits
Millimeter wave technology
MMICs
Monolithic integrated circuits
Packaging
Radiofrequency integrated circuits
Online Access:Request full text
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Summary:Since the 1980s, NTT has been developing three- dimensional (3D) monolith microwave integrated circuits (MMICs) to achieve small-size and low-cost ICs. The usage of 3D MMICs is a very powerful technique, especially at quasi-millimeter and millimeter wave. We describe the structure and features of 3D MMICs, introduce several MMIC subsystems, and point out future directions and plans for using 3D MMICs.
ISSN:0149-645X
2576-7216
DOI:10.1109/MWSYM.2010.5517752