Solder Bump Maker with coining process on TSV chips for 3D packages

The electroplating and screen printing are widely used in the micro-electric industry but they have disadvantages of a complicated series of bumping process, equipments and materials. Furthermore, they are not suitable for the fine pitch bumping technology. To overcome these weak points, a maskless...

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Main Authors: Ki-Jun Sung, Kwang-Seong Choi, Byeong-Ok Lim, Hyun-Cheol Bae, Sun-Woo Choo, Jong-Tae Moon, Yong Hwan Kwon, Eun Soo Nam, Yong-Sung Eom
Format: Conference Proceeding
Language:English
Subjects:
Electronics packaging
Flip chip
Packaging
Printing
Resins
Three dimensional displays
Through-silicon vias
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creator Ki-Jun Sung
Kwang-Seong Choi
Byeong-Ok Lim
Hyun-Cheol Bae
Sun-Woo Choo
Jong-Tae Moon
Yong Hwan Kwon
Eun Soo Nam
Yong-Sung Eom
description The electroplating and screen printing are widely used in the micro-electric industry but they have disadvantages of a complicated series of bumping process, equipments and materials. Furthermore, they are not suitable for the fine pitch bumping technology. To overcome these weak points, a maskless bumping technology using SBM has been developed. Solder Bump Masker (SBM) technology does not need any special equipment and mask tools. It is composed of solder powder and a resin. The solder is Sn58Bi and the resin is designed to have low viscosity for theological characteristics of the solder droplets. In this paper, we optimized the bumping condition with controlling the process time. After bumping, the coining process, which the various loads were applied, has been investigated to get the bump with the extremely uniform heights. Finally, low-volume bumps with the excellent uniformity were successfully achieved.
doi_str_mv 10.1109/ICEPT.2010.5582448
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subjects Electronics packaging
Flip chip
Packaging
Printing
Resins
Three dimensional displays
Through-silicon vias
title Solder Bump Maker with coining process on TSV chips for 3D packages
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