Changes of the coplanarity of SMT-components during soldering and their Measurement

The coplanarity between the substrate (or printed board) and the SMD-package is a very important characteristic. This coplanarity depends on the warpage of the board and the package. An insufficient coplanarity can lead to open solder joints and/or bridges of the solder joints. Additional mechanical...

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Bibliographic Details
Main Authors: Wohlrabe, Heinz, Wolter, Klaus-Jürgen
Format: Conference Proceeding
Language:English
Subjects:
Cameras
Displacement measurement
Gratings
Ovens
Petroleum
Phase measurement
Online Access:Request full text
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Summary:The coplanarity between the substrate (or printed board) and the SMD-package is a very important characteristic. This coplanarity depends on the warpage of the board and the package. An insufficient coplanarity can lead to open solder joints and/or bridges of the solder joints. Additional mechanical stress (especially in z-direction) inside of the solder joints may also occur. The warpages of the packages and the boards change during a soldering process. The Thermoire®-Measurement gives the possibility to control the warpage under soldering conditions. The IPC-Bow and the IPC -Twist are characteristics, to evaluate the warpage of printed boards.
DOI:10.1109/ESTC.2010.5642842