Rapid prototyping of electronic modules combining Aerosol printing and Ink Jet printing

Maskless direct printing is a good candidate for rapid prototyping and even emerging for manufacturing of large scale electronics. Aiming for rapid prototyping of small multi-layer modules the study combines Aerosol Jet ® printing and ink jet printing. Conductive silver traces down to 20μm width wer...

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Bibliographic Details
Main Authors: Gieser, H A, Bonfert, D, Hengelmann, H, Wolf, H, Bock, K, Zollmer, V, Werner, C, Domann, G, Bahr, J, Ndip, I, Curran, B, Oehler, F, Milosiu, H
Format: Conference Proceeding
Language:English
Subjects:
Copper
RNA
Online Access:Request full text
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Summary:Maskless direct printing is a good candidate for rapid prototyping and even emerging for manufacturing of large scale electronics. Aiming for rapid prototyping of small multi-layer modules the study combines Aerosol Jet ® printing and ink jet printing. Conductive silver traces down to 20μm width were printed together with large interconnect areas on isolating layers of inorganic-organic hybrid polymer (ORMOCER ® ) and on glass substrates. New copper nickel inks and high-k ORMOCER ® s filled with barium titanate particles are paving a path to integrated printed resistors and capacitors. Although some issues still need to be resolved for a commercial grade process the detail solutions presented for the first time and the active integrated circuits and devices attached to the same substrate demonstrate a path and the principle technical feasibility of this method for heterogeneous integration.
DOI:10.1109/ESTC.2010.5642953