Packaging and Assembly for Integrated Photonics-A Review of the ePIXpack Photonics Packaging Platform

We review recent work done by the photonics packaging platform ePIXpack that serves the academic community with packaging and assembly developments in the area of integrated photonics. The paper includes recent examples of our packaging and assembly work, covering a broad range of technologies from...

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Bibliographic Details
Published in:IEEE journal of selected topics in quantum electronics 2011-05, Vol.17 (3), p.645-651
Main Authors: Zimmermann, L, Preve, G B, Tekin, T, Rosin, T, Landles, K
Format: Article
Language:English
Subjects:
Assembly
Communities
Couplings
Devices
Hybrid integrated-circuit packaging
Optical waveguides
Packaging
photonic integration
Photonics
Platforms
Quantum electronics
Radio frequency
Silicon
silicon-on-insulator (SOI)
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Description
Summary:We review recent work done by the photonics packaging platform ePIXpack that serves the academic community with packaging and assembly developments in the area of integrated photonics. The paper includes recent examples of our packaging and assembly work, covering a broad range of technologies from silicon photonics to InP-based devices.
ISSN:1077-260X
1558-4542
DOI:10.1109/JSTQE.2010.2084992