Flexible manufacturing of multichip modules for flip chip ICs

A quick-turn flexible process for designing, verifying, and manufacturing multichip modules for use with flip chip ICs was developed. The process starts with MCC's prefabricated customizable substrates. Laser based cut and link processes are used to program the necessary wires on the substrate....

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Bibliographic Details
Main Authors: Yee, I., Miracky, R., Reed, J., Lunceford, B., Minchuan Wang, Cobb, D., Caldwell, G.
Format: Conference Proceeding
Language:English
Subjects:
Bonding
Flexible manufacturing systems
Flip chip
Laser beam cutting
Manufacturing processes
Multichip modules
Optical arrays
Process design
Software tools
Wires
Online Access:Request full text
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Summary:A quick-turn flexible process for designing, verifying, and manufacturing multichip modules for use with flip chip ICs was developed. The process starts with MCC's prefabricated customizable substrates. Laser based cut and link processes are used to program the necessary wires on the substrate. Laser direct write is also used to redistribute the flip chip area array bond pads to match the bond pads on the substrate. An efficient design to manufacturing process is assisted with the use of a software tool that allows the user to place and route the interconnections, and prepares the information needed for fabrication of the multichip modules.
DOI:10.1109/MCMC.1997.569357