Embedding of 15um thin chip and passives in thin flexible substrate

This study demonstrates the embedding of ultra-thin 15um active chips and passives in flexible printed circuit substrates. We describe the process of fabricating the embedded-actives-and-passives modules, starting with the fabrication of the chips and passives, followed by chip bonding, lamination,...

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Bibliographic Details
Main Authors: Rajoo, Ranjan, Lim, Y Y, Chong, S C, Myo Paing, Moses, F D, Hong, Justin See Toh Wai, Sekhar, V N, Soon Wee Ho, Thew, S, Soon, Justin Wee Kim, Xiaowu Zhang
Format: Conference Proceeding
Language:English
Subjects:
Bonding forces
Copper
Fabrication
Polyimides
Resistors
Semiconductor device measurement
Substrates
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Summary:This study demonstrates the embedding of ultra-thin 15um active chips and passives in flexible printed circuit substrates. We describe the process of fabricating the embedded-actives-and-passives modules, starting with the fabrication of the chips and passives, followed by chip bonding, lamination, via exposure and via plating to build up the module. Mechanical integrity tests are then performed using moisture sensitivity, shear and bend tests. Results show good mechanical robustness of the modules, indicating a promising technology for implementation into manufacturing.
DOI:10.1109/EPTC.2010.5702689