Electrical performance evaluation for multi-chip assemblies using knowledge based approach

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Bibliographic Details
Main Authors: Pochang Hsu, Senthinathan, R., Rozenblit, J.W., Prince, J.L.
Format: Conference Proceeding
Language:English
Subjects:
Artificial intelligence
Assembly
Bonding
CMOS technology
Delay estimation
Electronics packaging
Frequency
Object oriented modeling
Power dissipation
Thermal resistance
Online Access:Request full text
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DOI:10.1109/EPEP.1992.572250