Electrothermal prediction model of Cu low k interconnection on glass substrate

The aim of this work is to determine a joule heating prediction model for thick copper/Low-k interconnects on glass substrate technology. Experiments and simulations have been used to define thermal conductivities of our stack material from thermal resistance study. In a second time, the thermal res...

Full description

Saved in:
Bibliographic Details
Main Authors: Siegert, L, Fiannaca, G, Roqueta, F, Gautier, G, Anceau, C
Format: Conference Proceeding
Language:English
Subjects:
Calibration
Copper
Equations
Heating
Mathematical model
Physics
Strips
Online Access:Request full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:The aim of this work is to determine a joule heating prediction model for thick copper/Low-k interconnects on glass substrate technology. Experiments and simulations have been used to define thermal conductivities of our stack material from thermal resistance study. In a second time, the thermal resistance is used as quantitative response to predict the joule temperature in the strip. The experimental R thermic results are well fit with a quadratic model which combined with the thermal coefficient of resistance formalism; allow us to define an analytical temperature joule heating formula. This methodology to define an analytical joule heating formula can be widely used to determine the maximum operating conditions and can be implemented in design rules manuals.
DOI:10.1109/ESIME.2011.5765765