MCM-C cost comparison: Fodel(R) vs. Diffusion Patterning/sup TM/ vs. Green Tape/sup TM

In this paper, the results of a cost model study comparing Diffusion Patterning/sup TM/, Fodel(R), and Green Tape/sup TM/ implementations of a 10 chip Viking SuperSPARC/sup TM/ Module is reviewed. Results include a discussion of key assumptions and a sensitivity analysis performed to determine how a...

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Bibliographic Details
Main Authors: Page, J., Amey, D.I., Draudt, R., Inman, M., Horowitz, S.J.
Format: Conference Proceeding
Language:English
Subjects:
Ceramics
Circuits
Conducting materials
Costs
Multichip modules
Packaging
Sensitivity analysis
Substrates
Thick films
Workstations
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Summary:In this paper, the results of a cost model study comparing Diffusion Patterning/sup TM/, Fodel(R), and Green Tape/sup TM/ implementations of a 10 chip Viking SuperSPARC/sup TM/ Module is reviewed. Results include a discussion of key assumptions and a sensitivity analysis performed to determine how assumptions influenced cost for each process. These results identify cost drivers, and suggest opportunities for improving the cost effectiveness of each process.
DOI:10.1109/ICMCM.1997.581147