Identification of stress-induced leakage current components and the corresponding trap models in SiO/sub 2/ films

Time-decay stress-induced leakage current (SILC) has been systematically investigated for the cases of both Fowler-Nordheim (FN) stress and substrate hot-hole stress. From the three viewpoints of the reproducibility of the-current component for the gate voltage scan, the change of oxide charge durin...

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Bibliographic Details
Published in:IEEE transactions on electron devices 1997-06, Vol.44 (6), p.986-992
Main Authors: Sakakibara, K., Ajika, N., Hatanaka, M., Miyoshi, H., Yasuoka, A.
Format: Article
Language:English
Subjects:
Annealing
Current measurement
Electric breakdown
Electron traps
Hot carriers
Leakage current
Substrates
Thermal resistance
Thermal stresses
Voltage
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Summary:Time-decay stress-induced leakage current (SILC) has been systematically investigated for the cases of both Fowler-Nordheim (FN) stress and substrate hot-hole stress. From the three viewpoints of the reproducibility of the-current component for the gate voltage scan, the change of oxide charge during the gate voltage scan, and the resistance of the current component to thermal annealing, it has been found that time-decay stress-induced leakage current is composed of five current components, regardless of stress type. Trap models corresponding to each current component have been proposed. In addition, it has also been proven that holes generate the electron traps related to one of those current components.
ISSN:0018-9383
1557-9646
DOI:10.1109/16.585555