Advanced diamond based metal matrix composites for thermal management of RF devices

GaN based RF devices are pushing the threshold on existing thermal management materials. High heat fluxes and the need for a heat spreader material with low CTE that is a close match to the device material (e.g. Silicon Carbide) is driving the need for higher thermal conductivity (>;450W/mK) solu...

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Bibliographic Details
Main Authors: Loutfy, K, Hirotsuru, H
Format: Conference Proceeding
Language:English
Subjects:
aluminum diamond
diamond MMC
Diamond-like carbon
Heating
high conductivity heat spreader
high TC and low CTE material
Lead
Matrix converters
metal matrix composite
Radio frequency
Online Access:Request full text
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Summary:GaN based RF devices are pushing the threshold on existing thermal management materials. High heat fluxes and the need for a heat spreader material with low CTE that is a close match to the device material (e.g. Silicon Carbide) is driving the need for higher thermal conductivity (>;450W/mK) solutions. Aluminum diamond has been developed to meet this need with a CTE of 7.5ppm/K and thermal conductivity of 500W/mK.
DOI:10.1109/WAMICON.2011.5872860