Optimizing the design parameters of adhesively bonded assemblies to enhance reliability and performance of the CZT detectors

We utilize a stress analysis model for thermo-elastic problem in CZT adhesively bonded assemblies. We infer from experimental results that thermal induced stresses, strains, and displacements in the adhesive layer often are the root cause of distorted or shifted spectra. Our hypothesis is that, stre...

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Bibliographic Details
Main Authors: Taherion, S, Chen, H, Pinghe Lu, Awadalla, S, Bindley, G
Format: Conference Proceeding
Language:English
Subjects:
Assembly
Detectors
Pixel
Shearing
Stress
Temperature
Thermal stresses
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Summary:We utilize a stress analysis model for thermo-elastic problem in CZT adhesively bonded assemblies. We infer from experimental results that thermal induced stresses, strains, and displacements in the adhesive layer often are the root cause of distorted or shifted spectra. Our hypothesis is that, stress may change local electric field and charge transport properties of the region at vicinity of the pixel. It is assumed that the adhesive layer which consists of a large number of pieces with different Young's moduli, Poisson's ratio, sizes, and coefficients of thermal expansion is cured at elevated temperature and lowered to room temperature. Our analytical and experimental results indicate that, curing temperature, length to thickness ratio for adhesive pieces, and Young's moduli are key considerations in reducing the thermal stress on the assemblies.
ISSN:1082-3654
2577-0829
DOI:10.1109/NSSMIC.2010.5874557