Automated SEM Offset using programmed defects

Defect inspection plays a large role in the development and manufacture of semiconductor technologies. Defects detected in today's inspections tools are generally a fraction of a micron and require SEM review to analyze and justify corrective measures. It is very important that the review SEM d...

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Bibliographic Details
Main Authors: Patterson, O. D., Stamper, A., Hahn, R.
Format: Conference Proceeding
Language:English
Subjects:
Accuracy
Adaptive optics
Arrays
defect offset
deskew
Inspection
Logic gates
Metals
Numerical analysis
review SEM
SEM Alignment
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Description
Summary:Defect inspection plays a large role in the development and manufacture of semiconductor technologies. Defects detected in today's inspections tools are generally a fraction of a micron and require SEM review to analyze and justify corrective measures. It is very important that the review SEM drives to the exact location of the defects as a FoV (Field of View) of 2 μm is necessary to provide the resolution needed for defect redetection without the inefficiencies associated with repeated `zooming' of the image. A methodology which allows quick and accurate alignment of the review SEM to the defects in the results file is presented. This methodology uses a special structure containing programmed defects. The methodology is illustrated using the challenging example of PWQ wafers.
ISSN:1078-8743
2376-6697
DOI:10.1109/ASMC.2011.5898212