Automated SEM Offset using programmed defects

Defect inspection plays a large role in the development and manufacture of semiconductor technologies. Defects detected in today's inspections tools are generally a fraction of a micron and require SEM review to analyze and justify corrective measures. It is very important that the review SEM d...

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Main Authors: Patterson, O. D., Stamper, A., Hahn, R.
Format: Conference Proceeding
Language:English
Subjects:
Accuracy
Adaptive optics
Arrays
defect offset
deskew
Inspection
Logic gates
Metals
Numerical analysis
review SEM
SEM Alignment
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Stamper, A.
Hahn, R.
description Defect inspection plays a large role in the development and manufacture of semiconductor technologies. Defects detected in today's inspections tools are generally a fraction of a micron and require SEM review to analyze and justify corrective measures. It is very important that the review SEM drives to the exact location of the defects as a FoV (Field of View) of 2 μm is necessary to provide the resolution needed for defect redetection without the inefficiencies associated with repeated `zooming' of the image. A methodology which allows quick and accurate alignment of the review SEM to the defects in the results file is presented. This methodology uses a special structure containing programmed defects. The methodology is illustrated using the challenging example of PWQ wafers.
doi_str_mv 10.1109/ASMC.2011.5898212
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source IEEE Electronic Library (IEL) Conference Proceedings
subjects Accuracy
Adaptive optics
Arrays
defect offset
deskew
Inspection
Logic gates
Metals
Numerical analysis
review SEM
SEM Alignment
title Automated SEM Offset using programmed defects
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