CuBOL (Cu-column on BOL) technology: A low cost flip chip solution scalable to high I/O density, fine bump pitch and advanced Si-nodes

• Main Authors: Movva, S., Bezuk, S., Bchir, O., Shah, M., Joshi, M., Pendse, R., Ouyang, E., Kim, Y. C., Park, S. W., Lee, H. T., Kim, S. S., Bae, H. I., Na, G. C., Lee, K.
• Format: Conference Proceeding
• Language: English
• Subjects: Assembly; Flip chip; Reliability; Routing; Strontium; Substrates
• ISSN: 0569-5503; 2377-5726
• DOI: 10.1109/ECTC.2011.5898574

An innovative packaging solution - `Cu-column on BOL' (CuBOL) is developed that dramatically reduces flip chip package cost and offers superior product reliability, thus posing an important flip chip package solution in mobile product applications. The CuBOL technology, utilizing the fcCuBE™ offering by STATS ChipPAC, entails proprietary changes in the bump interconnect structure using Cu-column bump attached to a narrow trace or bond-on-lead (BOL) on substrate without any solder resist confinement (open SR) in the peripheral I/O region of the die. This enables improved routing efficiency on the substrate top layer thus allowing conversion of a flip chip substrate from original 4L to 2L without compromising functionality. The cost of the flip chip package is lowered by means of reduced substrate layer count, removal of solder on pad (SOP) and solder mask and relaxed design rules. When combined with high density substrate strip design and molded underfill (MUF), this process further lowers the manufacturing cost. Use of Cu-column bump with Pb-free solder cap used in CuBOL technology helps achieve a `Green' package solution, which is complimented by improved package reliability benefits achieved by a remarkable reduction of package stress due to the resulting interconnect structure. The CuBOL technology has also been proven to protect the extreme or ultra low K (ELK/ULK) die-electric against cracking or delamination as confirmed with empirical data generated using advanced silicon node test vehicles and further substantiated by thermo-mechanical simulation results. This paper summarizes the multidisciplinary effort undertaken to develop and qualify CuBOL technology using a 7×7 mm fcTFBGA package as test vehicle (TV). Existing substrate design in a 1-2-1 laminate build-up substrate was comfortably routed into 2 layer substrate design, yet maintaining the I/O count, original bump lay-out & ball map and the original bump-to-ball netlist by applying more efficient routing scheme offered by CuBOL technology. TV wafers were bumped using the composite structure of Cu-column with a Pb-free solder cap. Different aspect ratio of Cu-column height to solder cap height were evaluated to find the optimal one to ensure robust joint formation. Flip chip attach process using composite Cu-column bump with narrow BOL pad was studied in detail in terms of impact of design, and process factors on non-wet, solder short and warpage performance. Side by side comparison of original