Analysis of temperature field of Embedded Multi-Chip Module

For the Embedded Multi-Chip Module, the placement of the chip directly affects the internal temperature distribution, thereby affecting the reliability. In this paper, taking Embedded Multi-Chip Module as the research object, using ANSYS software to establish embedded type MCM model, performing fini...

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Bibliographic Details
Main Authors: Huang Chunyue, Wang Bin, Li Tianming, Wei Hegeng
Format: Conference Proceeding
Language:English
Subjects:
Finite element methods
Heat sinks
Layout
Substrates
Temperature distribution
Thermal analysis
Thermal conductivity
Online Access:Request full text
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Summary:For the Embedded Multi-Chip Module, the placement of the chip directly affects the internal temperature distribution, thereby affecting the reliability. In this paper, taking Embedded Multi-Chip Module as the research object, using ANSYS software to establish embedded type MCM model, performing finite element analysis of Embedded Multi-Chip Module temperature field under the condition of different substrates, different air convection coefficient and the use of heat sink, obtaining temperature distribution of Embedded-type MCM. The results show that different substrates and different air convection coefficient will affect the chip temperature distribution; using heat sink can significantly reduce the chip temperature.
DOI:10.1109/ICEPT.2011.6066952