Investigations of fluxless flip-chip bonding using vacuum ultraviolet and formic acid vapor surface treatment

We studied the effects of surface treatment using vacuum ultraviolet (VUV) and formic acid vapor for SnCu-Au flip-chip bonding. Sn-rich solder bumps are widely used for flip-chip interconnections because of low melting temperature and high mechanical strength. For fine pitch interconnections, surfac...

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Main Authors: Unami, N., Noma, H., Sakuma, K., Shigetou, A., Shoji, S., Mizuno, J.
Format: Conference Proceeding
Language:eng ; jpn
Subjects:
Bonding
Flip chip
Silicon
Surface contamination
Surface treatment
Three dimensional displays
Tin
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creator Unami, N.
Noma, H.
Sakuma, K.
Shigetou, A.
Shoji, S.
Mizuno, J.
description We studied the effects of surface treatment using vacuum ultraviolet (VUV) and formic acid vapor for SnCu-Au flip-chip bonding. Sn-rich solder bumps are widely used for flip-chip interconnections because of low melting temperature and high mechanical strength. For fine pitch interconnections, surface modification is needed before the bonding process. X-ray Photoelectron Spectroscopy (XPS) and Auger Electron Spectroscopy (AES) were used to investigate Sn surfaces. The results showed how the VUV/O 3 surface treatment removes the carbon-based organic contaminants from the Sn surfaces and the formic acid treatment reduces the metal oxides of Sn. Combination of VUV/O 3 and formic acid treatments improved shear strength of a bonded sample. The average shear strength of each bump with VUV/O 3 and/or formic acid treatment is about twice that of a bump with no treatment.
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source IEEE Electronic Library (IEL) Conference Proceedings
subjects Bonding
Flip chip
Silicon
Surface contamination
Surface treatment
Three dimensional displays
Tin
title Investigations of fluxless flip-chip bonding using vacuum ultraviolet and formic acid vapor surface treatment
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