PECVD silicon carbide for micromachined transducers

We report preliminary work on PECVD amorphous hydrogenated silicon carbide (a-SiC:H) as a material with many potential applications in micromachined transducers. Four examples are presented: an electrochemical probe; a fully packaged, encapsulated pressure sensor; a sealed and coated microfluidic ch...

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Bibliographic Details
Main Authors: Flannery, A.F., Mourlas, N.J., Storment, C.W., Tsai, S., Tan, S.H., Kovacs, G.T.A.
Format: Conference Proceeding
Language:English
Subjects:
Amorphous materials
Etching
Frequency
Glass
Microfluidics
Packaging
Probes
Silicon carbide
Stress
Transducers
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Summary:We report preliminary work on PECVD amorphous hydrogenated silicon carbide (a-SiC:H) as a material with many potential applications in micromachined transducers. Four examples are presented: an electrochemical probe; a fully packaged, encapsulated pressure sensor; a sealed and coated microfluidic channel; and deep etched channels in glass. A designed experiment was undertaken in an attempt to correlate stress, resistivity and wet etchability with the following process parameters: pressure, CH/sub 4/ flow rate, low frequency power, low frequency cycle time, high frequency power, and high frequency cycle time. While this preliminary work does demonstrate a CMOS compatible, insulating thin film with low stress (
DOI:10.1109/SENSOR.1997.613622