EDA solutions to new-defect detection in advanced process technologies

For decades, EDA test generation tools for digital logic have relied on the Stuck-At fault model, despite the fact that process technologies moved forward from TTL (for which the Stuck-At fault model was originally developed) to nanometer-scale CMOS. Under pressure from their customers, especially i...

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Bibliographic Details
Main Authors: Marinissen, E. J., Vandling, G., Goel, S. K., Hapke, F., Rivers, J., Mittermaier, N., Bahl, S.
Format: Conference Proceeding
Language:English
Subjects:
Automatic test pattern generation
Circuit faults
Delay
Libraries
Production
Online Access:Request full text
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Description
Summary:For decades, EDA test generation tools for digital logic have relied on the Stuck-At fault model, despite the fact that process technologies moved forward from TTL (for which the Stuck-At fault model was originally developed) to nanometer-scale CMOS. Under pressure from their customers, especially in quality-sensitive application domains such as automotive, in recent years EDA tools have made great progress in improving their detection capabilities for new defects in advanced process technologies. For this Hot-Topic Session, we invited the three major EDA vendors to present their recent greatest innovations in hiqh-quality automatic test pattern generation, as well as their lead customers to testify of actual production results.
ISSN:1530-1591
1558-1101
DOI:10.1109/DATE.2012.6176444