Low temperature metal and polymer bonding for advanced infrared imaging sensors

Low temperature bonding is a critical process module for high density 3-D integration technology as well as wafer-level 3-D packaging. This presentation will review the use of such 3-D integration technologies in advanced infrared imaging sensors. Designs based on 3-D architectures enable infrared c...

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Bibliographic Details
Main Authors: Temple, D. S., Lueck, M., Malta, D., Vick, E.
Format: Conference Proceeding
Language:English
Subjects:
Bonding
Infrared imaging
Integrated circuit interconnections
Metals
Temperature sensors
Online Access:Request full text
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Summary:Low temperature bonding is a critical process module for high density 3-D integration technology as well as wafer-level 3-D packaging. This presentation will review the use of such 3-D integration technologies in advanced infrared imaging sensors. Designs based on 3-D architectures enable infrared cameras that are characterized by high performance, low power, low weight and a small form factor. Such cameras are expected to be used widely in defense, security and commercial markets. The presentation will highlight recent 3-D integration technology demonstrations at RTI that employ low temperature metal and polymer bonding. We have demonstrated 99.99% operability in large arrays of 3-D interconnects with pitches down to 10 μm.
DOI:10.1109/LTB-3D.2012.6238044