A CMOS embedded RF-MEMS tunable capacitor for multi-band/multi-mode smartphones

This paper reports on 1-chip RF-MEMS tunable capacitor that equips CMOS driver circuit in the underlying layer. A Wafer Level Chip Scale Package (WLCSP) optimized for RF-MEMS is employed to minimize the module size. The MEMS actuation voltage is generated by an Actuation Voltage Generator (AVG). The...

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Bibliographic Details
Main Authors: Kurui, Y., Yamazaki, H., Shimooka, Y., Saito, T., Ogawa, E., Ogawa, T., Ikehashi, T., Sugizaki, Y., Shibata, H.
Format: Conference Proceeding
Language:English
Subjects:
Capacitance
Capacitors
CMOS integrated circuits
Electrodes
Micromechanical devices
Noise
Radio frequency
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Summary:This paper reports on 1-chip RF-MEMS tunable capacitor that equips CMOS driver circuit in the underlying layer. A Wafer Level Chip Scale Package (WLCSP) optimized for RF-MEMS is employed to minimize the module size. The MEMS actuation voltage is generated by an Actuation Voltage Generator (AVG). The boost mechanism employed in the AVG enables instant high voltage generation and reduction of the dielectric charging. The measured noise at RF frequencies is less than -120dbm, thanks to a shield metal layer formed between MEMS and CMOS layers. To achieve high power handing and high creep immunity, we employ the previously reported techniques, the Quadruple Series Capacitor (QSC) [1] and the SiN springs [2]. The quality factor measured in the WLCSP is larger than 100 at 1GHz. The capacitance can be changed from 1.4pF to 5pF by a step of 0.45pF.
ISSN:0569-5503
2377-5726
DOI:10.1109/ECTC.2012.6248814