Optimization of geometrical parameters of optical interconnect module based on double side perforated silicon optical platform for high coupling efficiency

We demonstrated a new structure of optical interconnect module based on double side perforated silicon optical platform. This structure can eliminate the use of micro mirrors, lens, and guide pin, leading to a reduced packaging cost and volume. Simulation results show that the proposed structure can...

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Bibliographic Details
Main Authors: Bong Kyu Jeong, Ravindran, S., Eun Kyu Kang, Sung Hyun Cha, Yong Tak Lee
Format: Conference Proceeding
Language:English
Subjects:
Couplings
Optical coupling
Optical device fabrication
Optical fibers
Optical interconnections
Vertical cavity surface emitting lasers
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Summary:We demonstrated a new structure of optical interconnect module based on double side perforated silicon optical platform. This structure can eliminate the use of micro mirrors, lens, and guide pin, leading to a reduced packaging cost and volume. Simulation results show that the proposed structure can result in high coupling efficiency with relaxed permissible error for assembly.
ISSN:2166-8884
2166-8892
DOI:10.1109/OECC.2012.6276759