Developing functional Prototypes by package modification using plasma FIB technology

Packaging technology plays a key role in the performance of many analog and RF circuits. Due to the size and geometries of interconnects, FIB based circuit edit has not been practical on the package. Plasma FIB (PFIB) technology allows cuts and rewiring in the package substrate to create fully testa...

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Bibliographic Details
Main Authors: Gonzales, M., Cruz, R., Parley, M., Lau, J., DiBattista, M., Routh, B., Landin, T., Carleson, P., Huggins, E., Mani, K.
Format: Conference Proceeding
Language:English
Subjects:
Copper
Integrated circuit interconnections
Plasmas
Prototypes
Substrates
Online Access:Request full text
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Description
Summary:Packaging technology plays a key role in the performance of many analog and RF circuits. Due to the size and geometries of interconnects, FIB based circuit edit has not been practical on the package. Plasma FIB (PFIB) technology allows cuts and rewiring in the package substrate to create fully testable prototypes.
ISSN:1946-1542
1946-1550
DOI:10.1109/IPFA.2012.6306324