Pressure free sintering of silver nanoparticles to silver substrate using weakly binding ligands

The use of a weakly binding ligand to facilitate sintering between particles and a planar substrate in the absence of pressure and at low homologous temperature has been explored. Ag nanoparticles in the 5-15 nm range suspended in water and stabilized by a BH 4 complex were dropped onto a polished A...

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Main Authors: Durairaj, R., Ashayer, R., Kotadia, H. R., Haria, N., Lorenz, C., Mokhtari, O., Mannan, S. H.
Format: Conference Proceeding
Language:English
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Bonding
Computational modeling
Substrates
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creator Durairaj, R.
Ashayer, R.
Kotadia, H. R.
Haria, N.
Lorenz, C.
Mokhtari, O.
Mannan, S. H.
description The use of a weakly binding ligand to facilitate sintering between particles and a planar substrate in the absence of pressure and at low homologous temperature has been explored. Ag nanoparticles in the 5-15 nm range suspended in water and stabilized by a BH 4 complex were dropped onto a polished Ag substrate heated to 333 K. The Ag particles sintered to each other and to the substrate to form a largely pore free system. A molecular dynamics simulation is used to understand the theoretical limits of pressure free sintering and practical implications for adhesive systems based on Ag nanoparticle suspensions are discussed.
doi_str_mv 10.1109/NANO.2012.6321890
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subjects Bonding
Computational modeling
Substrates
title Pressure free sintering of silver nanoparticles to silver substrate using weakly binding ligands
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