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Low dose SIMOX and impact of ITOX process on quality of SOI film
Summary form only given. Internal thermal oxidation (ITOX) has been shown to improve the quality of buried oxide (BOX) in low dose (4E17 cm/sup -2/) SOI SIMOX material. SOI film quality of ITOX SIMOX was determined to be as good as bulk in terms of the integrity of gate oxide grown on it. We have in...
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creator | Maszara, W.P. Bennett, J. Boden, T. Dockerty, R. Gondran, C.F.H. Jackett-Murphy, S. Vasudev, P.K. Anc, M.J. Hovel, H. |
description | Summary form only given. Internal thermal oxidation (ITOX) has been shown to improve the quality of buried oxide (BOX) in low dose (4E17 cm/sup -2/) SOI SIMOX material. SOI film quality of ITOX SIMOX was determined to be as good as bulk in terms of the integrity of gate oxide grown on it. We have investigated low dose SIMOX material and the impact of its high temperature annealing as well as the subsequent ITOX process on structure and electrical properties of its SOI film. Several new findings about the SOI film quality and its relationship to process parameters are reported. |
doi_str_mv | 10.1109/SOI.1997.634911 |
format | conference_proceeding |
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Internal thermal oxidation (ITOX) has been shown to improve the quality of buried oxide (BOX) in low dose (4E17 cm/sup -2/) SOI SIMOX material. SOI film quality of ITOX SIMOX was determined to be as good as bulk in terms of the integrity of gate oxide grown on it. We have investigated low dose SIMOX material and the impact of its high temperature annealing as well as the subsequent ITOX process on structure and electrical properties of its SOI film. 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Internal thermal oxidation (ITOX) has been shown to improve the quality of buried oxide (BOX) in low dose (4E17 cm/sup -2/) SOI SIMOX material. SOI film quality of ITOX SIMOX was determined to be as good as bulk in terms of the integrity of gate oxide grown on it. We have investigated low dose SIMOX material and the impact of its high temperature annealing as well as the subsequent ITOX process on structure and electrical properties of its SOI film. Several new findings about the SOI film quality and its relationship to process parameters are reported.</description><subject>Annealing</subject><subject>Argon</subject><subject>Atmospheric waves</subject><subject>Atomic force microscopy</subject><subject>Etching</subject><subject>MOS capacitors</subject><subject>Oxidation</subject><subject>Photoconductivity</subject><subject>Rough surfaces</subject><subject>Temperature</subject><issn>1078-621X</issn><issn>2577-2295</issn><isbn>9780780339385</isbn><isbn>078033938X</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>1997</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><recordid>eNp9jk0LgkAYhF_6gKQ8B53eP6C5rqvtLYgiofBgh26x5Aob2pprhP--jTo3DAwzz2UA5iTwCQn4Ms9Sn3Ce-DGNOCEDcEKWJF4YcjYElyerwJpSTldsBA6xzYtDcp6Aa8wtsIpYxFnkwPqgX1hoIzFPj9kZxb1AVTfi2qEuMT3ZqWn1VRqD-o6Pp6hU13-QfYClquoZjEtRGen-cgqL3fa02XtKSnlpWlWLtr98b9K_8A3fgjqG</recordid><startdate>1997</startdate><enddate>1997</enddate><creator>Maszara, W.P.</creator><creator>Bennett, J.</creator><creator>Boden, T.</creator><creator>Dockerty, R.</creator><creator>Gondran, C.F.H.</creator><creator>Jackett-Murphy, S.</creator><creator>Vasudev, P.K.</creator><creator>Anc, M.J.</creator><creator>Hovel, H.</creator><general>IEEE</general><scope>6IE</scope><scope>6IL</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIL</scope></search><sort><creationdate>1997</creationdate><title>Low dose SIMOX and impact of ITOX process on quality of SOI film</title><author>Maszara, W.P. ; Bennett, J. ; Boden, T. ; Dockerty, R. ; Gondran, C.F.H. ; Jackett-Murphy, S. ; Vasudev, P.K. ; Anc, M.J. ; Hovel, H.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-ieee_primary_6349113</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>1997</creationdate><topic>Annealing</topic><topic>Argon</topic><topic>Atmospheric waves</topic><topic>Atomic force microscopy</topic><topic>Etching</topic><topic>MOS capacitors</topic><topic>Oxidation</topic><topic>Photoconductivity</topic><topic>Rough surfaces</topic><topic>Temperature</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Maszara, W.P.</creatorcontrib><creatorcontrib>Bennett, J.</creatorcontrib><creatorcontrib>Boden, T.</creatorcontrib><creatorcontrib>Dockerty, R.</creatorcontrib><creatorcontrib>Gondran, C.F.H.</creatorcontrib><creatorcontrib>Jackett-Murphy, S.</creatorcontrib><creatorcontrib>Vasudev, P.K.</creatorcontrib><creatorcontrib>Anc, M.J.</creatorcontrib><creatorcontrib>Hovel, H.</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan All Online (POP All Online) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE/IET Electronic Library</collection><collection>IEEE Proceedings Order Plans (POP All) 1998-Present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Maszara, W.P.</au><au>Bennett, J.</au><au>Boden, T.</au><au>Dockerty, R.</au><au>Gondran, C.F.H.</au><au>Jackett-Murphy, S.</au><au>Vasudev, P.K.</au><au>Anc, M.J.</au><au>Hovel, H.</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>Low dose SIMOX and impact of ITOX process on quality of SOI film</atitle><btitle>1997 IEEE International SOI Conference Proceedings</btitle><stitle>SOI</stitle><date>1997</date><risdate>1997</risdate><spage>18</spage><epage>19</epage><pages>18-19</pages><issn>1078-621X</issn><eissn>2577-2295</eissn><isbn>9780780339385</isbn><isbn>078033938X</isbn><abstract>Summary form only given. Internal thermal oxidation (ITOX) has been shown to improve the quality of buried oxide (BOX) in low dose (4E17 cm/sup -2/) SOI SIMOX material. SOI film quality of ITOX SIMOX was determined to be as good as bulk in terms of the integrity of gate oxide grown on it. We have investigated low dose SIMOX material and the impact of its high temperature annealing as well as the subsequent ITOX process on structure and electrical properties of its SOI film. Several new findings about the SOI film quality and its relationship to process parameters are reported.</abstract><pub>IEEE</pub><doi>10.1109/SOI.1997.634911</doi></addata></record> |
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identifier | ISSN: 1078-621X |
ispartof | 1997 IEEE International SOI Conference Proceedings, 1997, p.18-19 |
issn | 1078-621X 2577-2295 |
language | eng |
recordid | cdi_ieee_primary_634911 |
source | IEEE Electronic Library (IEL) Conference Proceedings |
subjects | Annealing Argon Atmospheric waves Atomic force microscopy Etching MOS capacitors Oxidation Photoconductivity Rough surfaces Temperature |
title | Low dose SIMOX and impact of ITOX process on quality of SOI film |
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