A Survey Of Critical Metrology Needs For IC Interconnect Processes Based On Assessment By Quality Function Deployment (qfd) Methodology

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Bibliographic Details
Main Authors: Pope, D.E., Prough, S., Wieneke, K.
Format: Conference Proceeding
Language:English
Subjects:
Bonding
Inspection
Metrology
Packaging
Process planning
Quality function deployment
Semiconductor device measurement
Technology planning
Testing
Wire
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DOI:10.1109/IEMT.1993.639739