Pin Brazing Technology For A High Performance Aluminum Nitride Package

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Bibliographic Details
Main Authors: Iyogi, K., Yamakawa, K., Koiwa, K., Yasumoto, T., Matsu-ura, T., Endo, M., Iwase, N.
Format: Conference Proceeding
Language:English
Subjects:
Adhesives
Aluminum nitride
Gold
Land surface
Packaging
Pins
Residual stresses
Rough surfaces
Surface roughness
Transistors
Online Access:Request full text
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DOI:10.1109/IEMT.1993.639750